Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-W94AD6KBHX5E | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 312 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory | |
| Series | - | |
| Packaging | Tray | |
| Format - Memory | RAM | |
| Memory Type | Mobile LPDDR SDRAM | |
| Memory Size | 1G (64M x 16) | |
| Speed | 200MHz | |
| Interface | Parallel | |
| Voltage - Supply | 1.7 V ~ 1.95 V | |
| Operating Temperature | -25°C ~ 85°C | |
| Package / Case | 60-TFBGA | |
| Supplier Device Package | 60-VFBGA (8x9) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | W94AD6KBHX5E | |
| Related Links | W94AD6, W94AD6KBHX5E Datasheet, Winbond Electronics Corp. Distributor | |
![]() | FDS6900AS | MOSFET 2N-CH 30V 6.9A/8.2A 8SOIC | datasheet.pdf | |
![]() | LT1129CQ-3.3#TR | IC REG LDO 3.3V 0.7A 5DDPAK | datasheet.pdf | |
![]() | ESR10EZPF9762 | RES SMD 97.6K OHM 1% 0.4W 0805 | datasheet.pdf | |
![]() | RQ3E130MNTB1 | MOSFET N-CH 30V 13A HSMT8 | datasheet.pdf | |
![]() | 70152-1127 | SAFETY EDGE | datasheet.pdf | |
![]() | 10079248-11103LF | DDR3 240P SMT ASSY | datasheet.pdf | |
![]() | 77315-825-03LF | HEADER BERGSTIK R/A | datasheet.pdf | |
![]() | DCL27W2P300G1DLF | D-Sub Connector Plug, Male Pins 27 (25 + 2 Power) Position Through Hole Solder | datasheet.pdf | |
![]() | ACC06DTMS-S189 | CONN EDGECARD 12POS .100" | datasheet.pdf | |
![]() | 438416-1 | HSG REMOVEL TOOL | datasheet.pdf | |
![]() | AD5371 | 40-Channel, 14-Bit Serial Input, Voltage-Output DAC IC | datasheet.pdf | |
![]() | ADV476KN35 | CMOS Monolithic 256x18 Color Palette RAM-DAC IC | datasheet.pdf |