Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-W988D6FBGX6I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 312 | |
Category | Integrated Circuits (ICs) | |
Family | Memory | |
Series | - | |
Packaging | Tray | |
Format - Memory | RAM | |
Memory Type | Mobile LPSDR SDRAM | |
Memory Size | 256M (16M x 16) | |
Speed | 166MHz | |
Interface | Parallel | |
Voltage - Supply | 1.7 V ~ 1.95 V | |
Operating Temperature | -40°C ~ 85°C | |
Package / Case | 54-TFBGA | |
Supplier Device Package | 54-VFBGA (8x9) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | W988D6FBGX6I | |
Related Links | W988D6, W988D6FBGX6I Datasheet, Winbond Electronics Corp. Distributor |
![]() | NRPN242MAMS-RC | CONN HEADER 2MM DUAL SMD 48POS | datasheet.pdf | |
![]() | 929710-10-33-RK | CONN HEADER .100 DUAL STR 66POS | datasheet.pdf | |
![]() | AD5065ARUZ | IC DAC 16BIT SPI 14TSSOP | datasheet.pdf | |
![]() | 5-1614350-6 | RES SMD 16.5KOHM 0.1% 1/16W 0603 | datasheet.pdf | |
![]() | 195D684X0025S2T | CAP TANT 0.68UF 25V 20% 1507 | datasheet.pdf | |
![]() | RLR32C16R0GMBSL | RES 16 OHM 2% 1W AXIAL | datasheet.pdf | |
![]() | F2213/8 BK065 | HEAT SHRINK TUBE 3/8 BK 16X6" | datasheet.pdf | |
![]() | 1331-104H | FIXED IND 100UH 51MA 16.8 OHM | datasheet.pdf | |
![]() | 501HCF-ACAF | OSC PROG 0.7NS 20PPM 2.5X3.2MM | datasheet.pdf | |
![]() | BACC63CD22-2SW | CONN 3C 3#8 PIN RECP | datasheet.pdf | |
![]() | TV07RQF-21-79PD | TV 19C 17#22D 2#8(QUAD) PIN RE | datasheet.pdf | |
![]() | PLY17BN3721R0A2 | Capacitors Inductors Filters... | datasheet.pdf |