Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-WB3F200VD1 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | Multiple Devices 17/Apr/2015 | |
| Standard Package | 100 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | WB3 | |
| Packaging | Tray | |
| Connector Type | Receptacle, Center Strip Contacts | |
| Number of Positions | 200 | |
| Pitch | 0.020" (0.50mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | Board Guide, Solder Retention | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 30µin (0.76µm) | |
| Mated Stacking Heights | 4mm, 5mm | |
| Height Above Board | 0.098" (2.50mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | WB3F200VD1 | |
| Related Links | WB3F2, WB3F200VD1 Datasheet, JAE Electronics Distributor | |
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