Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-WB3F200VD1T | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
PCN Obsolescence/ EOL | Multiple Devices 17/Apr/2015 | |
Standard Package | 1,000 | |
Category | Connectors, Interconnects | |
Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
Series | WB3 | |
Packaging | Tray | |
Connector Type | Receptacle, Center Strip Contacts | |
Number of Positions | 200 | |
Pitch | 0.020" (0.50mm) | |
Number of Rows | 2 | |
Mounting Type | Surface Mount | |
Features | Board Guide, Solder Retention | |
Contact Finish | Gold | |
Contact Finish Thickness | 30µin (0.76µm) | |
Mated Stacking Heights | 4mm, 5mm | |
Height Above Board | 0.126" (3.20mm) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | WB3F200VD1T | |
Related Links | WB3F2, WB3F200VD1T Datasheet, JAE Electronics Distributor |
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