Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-WR-FL70P-VF50-N1-R1300 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 300 | |
| Category | Connectors, Interconnects | |
| Family | Rectangular - Board to Board Connectors - Arrays, Edge Type, Mezzanine | |
| Series | WR | |
| Packaging | Tape & Reel (TR) | |
| Connector Type | Plug, Outer Shroud Contacts | |
| Number of Positions | 70 | |
| Pitch | 0.020" (0.50mm) | |
| Number of Rows | 2 | |
| Mounting Type | Surface Mount | |
| Features | - | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 3.9µin (0.10µm) | |
| Mated Stacking Heights | 5mm, 5.5mm, 8mm | |
| Height Above Board | 0.157" (4.00mm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | WR-FL70P-VF50-N1-R1300 | |
| Related Links | WR-FL70P-VF, WR-FL70P-VF50-N1-R1300 Datasheet, JAE Electronics Distributor | |
![]() | SN74LVC139ADBR | IC DUAL 2-TO-4 DEC/DEMUX 16-SSOP | datasheet.pdf | |
![]() | 767161270GP | RES ARRAY 15 RES 27 OHM 16SOIC | datasheet.pdf | |
![]() | GSM10DTKI | CONN EDGECARD 20POS DIP .156 SLD | datasheet.pdf | |
![]() | 76383-317 | CONN HEADER 34PS.100 DL R/A GOLD | datasheet.pdf | |
![]() | NTMFS4851NT3G | MOSFET N-CH 30V 9.5A SO-8FL | datasheet.pdf | |
![]() | SAF-XC886-6FFA 5V AC | IC MCU 8BIT FLASH 48-TQFP | datasheet.pdf | |
![]() | N64S818HAS21I | IC SRAM 64KBIT 16MHZ 8SOIC | datasheet.pdf | |
![]() | RNC55H1492DSBSL | RES 14.9K OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | RNC55J2121BSB14 | RES 2.12K OHM 1/8W .1% AXIAL | datasheet.pdf | |
| SB285-015H | SWITCH PUSHBUTTON DPDT 6A 125V | datasheet.pdf | ||
![]() | ATS-11G-160-C3-R0 | HEATSINK 45X45X15MM L-TAB T412 | datasheet.pdf | |
![]() | HIF9-GPA | SERIES GUIDE PLATE HIF9 | datasheet.pdf |