Xilinx XC1701PDG8C

XC1701PDG8C picture photo
Mfg. Part Number
XC1701PDG8C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Configuration Memory, 1MX1, Serial, CMOS, PDIP8 IC
Datasheet Download
XC1701PDG8C.pdf
Availability of XC1701PDG8C

Available Quantity

9320 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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EIS Components is the stocking Distributor of XC1701PDG8C, we specialize in Xilinx all series electronic components. XC1701PDG8C can be shipped within 24 hours after order. If you have any demands for XC1701PDG8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC1701PDG8C Order Process
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Submit RFQ
We reply within 24 hours
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Specifications of XC1701PDG8C
Internal Part NumberEIS-XC1701PDG8C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC1701PDG8C today
SeriesXC1701
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.51
Number of CLBs-
Number of Terminals8
TechnologyCMOS
Feature1MX1
Package CodeDIP
Package ShapeRECTANGULAR
Package StyleIN-LINE Meter
Surface MountNO
Width7.62 mm
Length9.3599 mm
Moisture Sensitivity Level1
Peak Reflow Temperature (Cel)260
Combinatorial Delay of a CLB-Max-
alternatesXC1701PD8C-1489401667,XC1701PD8I-1489401670,XC1701PDG8I-2040297284
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC1701PDG8C
Alternative Part (Replacement)EIS-XC1701PDG8C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC170, XC1701PDG8C Datasheet, Xilinx Distributor
XC1701PDG8C Details Description
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