Xilinx XC17S150APDG8C
- Mfg. Part Number
- XC17S150APDG8C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Configuration Memory, 1040096X1, Serial, CMOS, PDIP8 IC
- Datasheet Download
- XC17S150APDG8C.pdf
Availability of XC17S150APDG8C
Available Quantity
9070 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC17S150APDG8C, we specialize in Xilinx all series electronic components. XC17S150APDG8C can be shipped within 24 hours after order. If you have any demands for XC17S150APDG8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC17S150APDG8C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC17S150APDG8C
| Internal Part Number | EIS-XC17S150APDG8C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC17S150APDG8C today | |
| Series | XC17S15 | |
| Lifecycle status | Discontinued | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.32.00.51 | |
| Number of CLBs | - | |
| Number of Terminals | 8 | |
| Technology | CMOS | |
| Feature | 1040096X1 | |
| Package Code | DIP | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE Meter | |
| Surface Mount | NO | |
| Width | 7.62 mm | |
| Length | 9.3599 mm | |
| Moisture Sensitivity Level | 1 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | XC17S150APD8C-1533381053,XC17S150APD8I-1533381054,XC17S150APDG8I-2040291764 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC17S150APDG8C | |
| Alternative Part (Replacement) | EIS-XC17S150APDG8C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC17S15, XC17S150APDG8C Datasheet, Xilinx Distributor | |
XC17S150APDG8C Details Description
Related parts for XC17S150APDG8C
 | LT1129IQ-3.3 | IC REG LDO 3.3V 0.7A 5DDPAK | datasheet.pdf | |
 | RR0816P-2672-D-42C | RES SMD 26.7KOHM 0.5% 1/16W 0603 | datasheet.pdf | |
 | MAX6855UK39D4+T | IC MPU SUPERVISOR SOT23-5 | datasheet.pdf | |
 | OSTVK101150 | TERM BLOCK HDR 10POS 45DEG 3.5MM | datasheet.pdf | |
| VI-B6V-IV-F1 | CONVERTER MOD DC/DC 5.8V 150W | datasheet.pdf | |
| M3446 SL002 | MULTI-PAIR 4COND 24AWG SHLD 500' | datasheet.pdf | |
| ATS-20D-174-C1-R0 | HEATSINK 30X30X35MM R-TAB | datasheet.pdf | |
| ATS-19E-98-C3-R0 | HEATSINK 45X45X15MM R-TAB T412 | datasheet.pdf | |
| MK2KP DC6 | RELAY | datasheet.pdf | |
| VJ0805D201JXCAR | CAP CER 200PF 200V NP0 0805 | datasheet.pdf | |
| 352106-1 | Z-PACK/A RAMH.110P. | datasheet.pdf | |
 | SIT9002AC-18N33ST | OSC MEMS PROG | datasheet.pdf |