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Xilinx XC17S30ASOG20C

XC17S30ASOG20C picture photo
Mfg. Part Number
XC17S30ASOG20C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Configuration Memory, 336768X1, Serial, CMOS, PDSO20 IC
Datasheet Download
XC17S30ASOG20C.pdf
Availability of XC17S30ASOG20C

Available Quantity

11180 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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EIS Components is the stocking Distributor of XC17S30ASOG20C, we specialize in Xilinx all series electronic components. XC17S30ASOG20C can be shipped within 24 hours after order. If you have any demands for XC17S30ASOG20C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC17S30ASOG20C Order Process
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Specifications of XC17S30ASOG20C
Internal Part NumberEIS-XC17S30ASOG20C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S30ASOG20C today
SeriesXC17S30
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.51
Number of CLBs-
Number of Terminals20
TechnologyCMOS
Feature336768X1
Package CodeSOP
Package ShapeRECTANGULAR
Package StyleSMALL OUTLINE Meter
Surface MountYES
Width7.5 mm
Length12.8 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)260
Combinatorial Delay of a CLB-Max-
alternatesXC17S30ASO20C-1533381073,XC17S30ASO20I-1533381074,XC17S30ASOG20I-2040291839
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S30ASOG20C
Alternative Part (Replacement)EIS-XC17S30ASOG20C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC17S30, XC17S30ASOG20C Datasheet, Xilinx Distributor
XC17S30ASOG20C Details Description
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