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Xilinx XC17S30PDG8C

XC17S30PDG8C picture photo
Mfg. Part Number
XC17S30PDG8C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Memory Circuit, 247968X1, CMOS, PDIP8 IC
Datasheet Download
XC17S30PDG8C.pdf
Availability of XC17S30PDG8C

Available Quantity

9080 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XC17S30PDG8C, we specialize in Xilinx all series electronic components. XC17S30PDG8C can be shipped within 24 hours after order. If you have any demands for XC17S30PDG8C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC17S30PDG8C Order Process
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Specifications of XC17S30PDG8C
Internal Part NumberEIS-XC17S30PDG8C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S30PDG8C today
SeriesXC17S3
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.71
Number of CLBs-
Number of Terminals8
TechnologyCMOS
Feature247968X1
Package CodeDIP
Package ShapeRECTANGULAR
Package StyleIN-LINE Meter
Surface MountNO
Width7.62 mm
Length9.3599 mm
Moisture Sensitivity Level1
Peak Reflow Temperature (Cel)250
Combinatorial Delay of a CLB-Max-
alternatesXC17S30PD8C-1437682434,XC17S30PD8I-1437682437,XC17S30PDG8I-2040291845
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S30PDG8C
Alternative Part (Replacement)EIS-XC17S30PDG8C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC17S3, XC17S30PDG8C Datasheet, Xilinx Distributor
XC17S30PDG8C Details Description
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