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Xilinx XC17S30PDG8I

XC17S30PDG8I picture photo
Mfg. Part Number
XC17S30PDG8I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Memory Circuit, 247968X1, CMOS, PDIP8 IC
Datasheet Download
XC17S30PDG8I.pdf
Availability of XC17S30PDG8I

Available Quantity

13130 Pieces

Can ship today

Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XC17S30PDG8I, we specialize in Xilinx all series electronic components. XC17S30PDG8I can be shipped within 24 hours after order. If you have any demands for XC17S30PDG8I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC17S30PDG8I Order Process
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Specifications of XC17S30PDG8I
Internal Part NumberEIS-XC17S30PDG8I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC17S30PDG8I today
SeriesXC17S3
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.32.00.71
Number of CLBs-
Number of Terminals8
TechnologyCMOS
Feature247968X1
Package CodeDIP
Package ShapeRECTANGULAR
Package StyleIN-LINE Meter
Surface MountNO
Width7.62 mm
Length9.3599 mm
Moisture Sensitivity Level1
Peak Reflow Temperature (Cel)250
Combinatorial Delay of a CLB-Max-
alternatesXC17S30PD8C-1437682434,XC17S30PD8I-1437682437,XC17S30PDG8C-2040291842
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC17S30PDG8I
Alternative Part (Replacement)EIS-XC17S30PDG8I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC17S3, XC17S30PDG8I Datasheet, Xilinx Distributor
XC17S30PDG8I Details Description
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