Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC17S30XLPD8I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | ||
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Obsolescence/ EOL | XC4000E,XLA,1700L,E,EL,17S00,XL Families 28/Jul/2010 | |
| Standard Package | 50 | |
| Category | Integrated Circuits (ICs) | |
| Family | Memory - Configuration Proms for FPGA's | |
| Series | - | |
| Packaging | Tube | |
| Programmable Type | OTP | |
| Memory Size | 300kb | |
| Voltage - Supply | 3 V ~ 3.6 V | |
| Operating Temperature | -40°C ~ 85°C | |
| Package / Case | 8-DIP (0.300", 7.62mm) | |
| Supplier Device Package | 8-PDIP | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC17S30XLPD8I | |
| Related Links | XC17S3, XC17S30XLPD8I Datasheet, Xilinx Distributor | |
![]() | ELJ-RE2N7DF2 | FIXED IND 2.7NH 500MA 100 MOHM | datasheet.pdf | |
![]() | 1130-330K | FIXED IND 33UH 13.5A 17 MOHM TH | datasheet.pdf | |
![]() | GZC26SGSN-M89 | CONN HEADER 26POS .100 R/A SMD | datasheet.pdf | |
![]() | 770101560P | RES ARRAY 9 RES 56 OHM 10SIP | datasheet.pdf | |
![]() | H3BBS-1006M | IDC CABLE - HSR10S/AE10M/HSR10S | datasheet.pdf | |
![]() | RBM30DTMI | CONN EDGECARD 60POS R/A .156 SLD | datasheet.pdf | |
![]() | H11AA4S(TA)-V | OPTOISO 5KV TRANS W/BASE 6SMD | datasheet.pdf | |
![]() | RNC55J3443BSB14 | RES 344K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | RC0402J472CS | RES SMD 4.7K OHM 5% 1/32W 01005 | datasheet.pdf | |
![]() | FH29BJ-34S-0.2SHW(05) | CONN FPC BOTTOM 34POS 0.20MM R/A | datasheet.pdf | |
![]() | F6N2.00BKBB | F6 SELF WRAP 2" BLACK 200' | datasheet.pdf | |
![]() | AD7713 | LC2MOS Loop-Powered Signal Conditioning ADC IC | datasheet.pdf |