Xilinx XC2C32-3CPG56C

XC2C32-3CPG56C picture photo
Mfg. Part Number
XC2C32-3CPG56C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Flash PLD, 3ns, 32-Cell, CMOS, PBGA56 IC
Datasheet Download
XC2C32-3CPG56C.pdf
Availability of XC2C32-3CPG56C

Available Quantity

10630 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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EIS Components is the stocking Distributor of XC2C32-3CPG56C, we specialize in Xilinx all series electronic components. XC2C32-3CPG56C can be shipped within 24 hours after order. If you have any demands for XC2C32-3CPG56C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC2C32-3CPG56C Order Process
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Specifications of XC2C32-3CPG56C
Internal Part NumberEIS-XC2C32-3CPG56C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC2C32-3CPG56C today
SeriesXC2C32-
Lifecycle statusDiscontinued
RoHS StatusRoHS compliant
HTS Code8542.39.00.01
Number of CLBs-
Number of Terminals56
TechnologyCMOS
Feature1 DEDICATED INPUTS, 33 I/O
Package CodeLFBGA
Package ShapeSQUARE
Package StyleGRID ARRAY, LOW PROFILE, FINE PITCH Meter
Surface MountYES
Width6 mm
Length6 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)260
Combinatorial Delay of a CLB-Max-
alternatesXC2C32-3CP56C-1942817080
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC2C32-3CPG56C
Alternative Part (Replacement)EIS-XC2C32-3CPG56C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC2C32-, XC2C32-3CPG56C Datasheet, Xilinx Distributor
XC2C32-3CPG56C Details Description
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