Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC2S150-5FG256C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan®-II | |
| Number of LABs/CLBs | 864 | |
| Number of Logic Elements/Cells | 3888 | |
| Total RAM Bits | 49152 | |
| Number of I/O | 176 | |
| Number of Gates | 150000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC2S150-5FG256C | |
| Related Links | XC2S150, XC2S150-5FG256C Datasheet, Xilinx Distributor | |
![]() | 2030.0249 | FUSE 750MA 125V TELCM 18.8MM PCB | datasheet.pdf | |
![]() | GMK316F475ZG-T | CAP CER 4.7UF 35V Y5V 1206 | datasheet.pdf | |
![]() | XRT5997IV-F | IC LIU E1 7CH 3.3V 100TQFP | datasheet.pdf | |
![]() | VI-J32-EX-S | CONVERTER MOD DC/DC 15V 75W | datasheet.pdf | |
![]() | RNC60H11R3FSRE6 | RES 11.3 OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | 62V11-02-110C | OPTICAL ENCODER | datasheet.pdf | |
![]() | 1537-51F | FIXED IND 33UH 185MA 3 OHM TH | datasheet.pdf | |
![]() | 1210-470J | FIXED IND 47NH 636MA 300 MOHM | datasheet.pdf | |
![]() | A-TB508-HG06 | TERMINAL BLOCK | datasheet.pdf | |
![]() | ATS-19D-53-C3-R0 | HEATSINK 30X30X30MM L-TAB T412 | datasheet.pdf | |
![]() | HMC679LC3CTR-R5 | IC FLIP-FLOP W/RESET 16SMD | datasheet.pdf | |
![]() | CM7396-000 | TINEL LOCK RING ADAPT | datasheet.pdf |