Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC2S50-6TQG144C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan®-II | |
| Number of LABs/CLBs | 384 | |
| Number of Logic Elements/Cells | 1728 | |
| Total RAM Bits | 32768 | |
| Number of I/O | 92 | |
| Number of Gates | 50000 | |
| Voltage - Supply | 2.375 V ~ 2.625 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 144-LQFP | |
| Supplier Device Package | 144-TQFP (20x20) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC2S50-6TQG144C | |
| Related Links | XC2S50-, XC2S50-6TQG144C Datasheet, Xilinx Distributor | |
![]() | 1762012001 | TERM BLOCK HDR 3POS R/A 3.5MM | datasheet.pdf | |
![]() | CDF1942SCG1 | DOOR STEEL 41.8X19.3X0.53" BE/GY | datasheet.pdf | |
![]() | GCB75DHRR | CONN CARD EXTEND 150PS .050" SLD | datasheet.pdf | |
![]() | IDT6116LA45TPG | IC SRAM 16KBIT 45NS 24DIP | datasheet.pdf | |
![]() | CE3392-60.000 | OSC XO 60.000MHZ HCMOS SMD | datasheet.pdf | |
| UVY1J472MRD | CAP ALUM 4700UF 20% 63V RADIAL | datasheet.pdf | ||
| UPMP-F960-EMIF-EK | KIT DEV UDP FOR C8051F960 | datasheet.pdf | ||
![]() | TD-4.096MBD-T | OSC MEMS 4.096MHZ CMOS SMD | datasheet.pdf | |
![]() | RN55E4642BBSL | RES 46.4K OHM 1/8W .1% AXIAL | datasheet.pdf | |
![]() | B20J1K75 | RES 1.75K OHM 20W 5% AXIAL | datasheet.pdf | |
![]() | 68716-414HLF | HEADER BERGSTIK | datasheet.pdf | |
![]() | 0387206330 | Connector Barrier Block Strip 30 Circuit 0.375" (9.53mm) | datasheet.pdf |