Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC2VP2-5FGG256I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Assembly Site Addition 01/Jun/2015 | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex®-II Pro | |
| Number of LABs/CLBs | 352 | |
| Number of Logic Elements/Cells | 3168 | |
| Total RAM Bits | 221184 | |
| Number of I/O | 140 | |
| Number of Gates | - | |
| Voltage - Supply | 1.425 V ~ 1.575 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-BGA | |
| Supplier Device Package | 256-FBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC2VP2-5FGG256I | |
| Related Links | XC2VP2-, XC2VP2-5FGG256I Datasheet, Xilinx Distributor | |
![]() | EEE-1EA331UP | CAP ALUM 330UF 20% 25V SMD | datasheet.pdf | |
![]() | EBC25DRTI | CONN EDGECARD 50POS DIP .100 SLD | datasheet.pdf | |
![]() | EMC28DRXN-S734 | CONN EDGECARD 56POS DIP .100 SLD | datasheet.pdf | |
![]() | RMCF1206JT4K70 | RES SMD 4.7K OHM 5% 1/4W 1206 | datasheet.pdf | |
![]() | MAX4916AELT+T | IC CURR LIMIT SWITCH 200MA 6UDFN | datasheet.pdf | |
![]() | AISC-1008-R027J-T | FIXED IND 27NH 1A 130 MOHM SMD | datasheet.pdf | |
![]() | VI-B5W-MW-F1 | CONVERTER MOD DC/DC 5.5V 100W | datasheet.pdf | |
![]() | RLR32C2401FRB14 | RES 2.4K OHM 1% 1W AXIAL | datasheet.pdf | |
![]() | PWR263S-35-4R00F | RES SMD 4 OHM 1% 35W D2PAK | datasheet.pdf | |
![]() | 679495-1 | PIN | datasheet.pdf | |
![]() | 885012008031 | CAP CER 1PF 50V NP0 1206 | datasheet.pdf | |
![]() | 2M859-013 | 2M WIRE HOLE FILLER #16 | datasheet.pdf |