Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC2VP70-5FFG1517C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
EDA / CAD Models | Download from Accelerated Designs | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Virtex®-II Pro | |
Number of LABs/CLBs | 8272 | |
Number of Logic Elements/Cells | 74448 | |
Total RAM Bits | 6045696 | |
Number of I/O | 964 | |
Number of Gates | - | |
Voltage - Supply | 1.425 V ~ 1.575 V | |
Mounting Type | Surface Mount | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 1517-BBGA, FCBGA | |
Supplier Device Package | 1517-FCBGA (40x40) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC2VP70-5FFG1517C | |
Related Links | XC2VP70-, XC2VP70-5FFG1517C Datasheet, Xilinx Distributor |
X5328V14 | IC SUPERVISOR CPU 32K EE 14TSSOP | datasheet.pdf | ||
345-026-540-804 | CARDEDGE 26POS DUAL .100 GREEN | datasheet.pdf | ||
RCM43DCST | CONN EDGECARD 86POS DIP .156 SLD | datasheet.pdf | ||
3-1879028-3 | RES SMD 6.65 OHM 0.1% 1/10W 0805 | datasheet.pdf | ||
2855/1 VI005 | HOOK-UP SOLID 22AWG VIOLET 100' | datasheet.pdf | ||
702095 | UPGRADE CD CCS 3.1 C5000 DSK | datasheet.pdf | ||
ATS-02H-27-C2-R0 | HEATSINK 70X70X12.7MM XCUT T766 | datasheet.pdf | ||
L177SDE09S | D-Sub Connector Receptacle, Female Sockets 9 Position Free Hanging (In-Line) Solder Cup | datasheet.pdf | ||
FLP2FR8.0-SBC | LIGHT PIPE ASSY 2MM 8" RD/GN | datasheet.pdf | ||
1852612-2 | HDM SAPR168F190F K CUT | datasheet.pdf | ||
SCSMAINSERT-W | SC SINGLE MODE FIBER INSERT, GRE | datasheet.pdf | ||
VPM100-25000 | XFRMR 2500VA MED GRADE CHASS MNT | datasheet.pdf |