Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC3S200AN-4FT256I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Other | Wafer Fab Transfer/Copper Wire 05/May/2014 | |
| Standard Package | 90 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan®-3AN | |
| Number of LABs/CLBs | 448 | |
| Number of Logic Elements/Cells | 4032 | |
| Total RAM Bits | 294912 | |
| Number of I/O | 195 | |
| Number of Gates | 200000 | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 256-LBGA | |
| Supplier Device Package | 256-FTBGA (17x17) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC3S200AN-4FT256I | |
| Related Links | XC3S200A, XC3S200AN-4FT256I Datasheet, Xilinx Distributor | |
![]() | BC237TF | TRANS NPN 45V 0.1A TO-92 | datasheet.pdf | |
![]() | GBC12DRSN-S273 | CONN EDGECARD 24POS DIP .100 SLD | datasheet.pdf | |
![]() | WW2JT6R80 | RES 6.8 OHM 1.5W 5% AXIAL | datasheet.pdf | |
![]() | 4000-51AW18AE999 | XFRMR LAMINATED 50VA CHAS MOUNT | datasheet.pdf | |
![]() | SI4368DY-T1-GE3 | MOSFET N-CH 30V 17A 8-SOIC | datasheet.pdf | |
![]() | 229-3-1REC5-33004-027 | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
![]() | 1815820000 | TERMINAL ZP 2.5/2AN/QV/10 | datasheet.pdf | |
![]() | RP73PF1J412RBTDF | RES SMD 412 OHM 0.1% 1/6W 0603 | datasheet.pdf | |
![]() | Y0022100K000T9L | RES 100K OHM 1W 0.01% RADIAL | datasheet.pdf | |
![]() | 1852346-1 | HDM SAPR125F155O LM CUTS | datasheet.pdf | |
![]() | NTMFS5C670NLT3G | MOSFET N-CH 60V 68A SO8FL | datasheet.pdf | |
![]() | XC3090A-6TQG176C | IC FPGA 138 I/O 160QFP | datasheet.pdf |