Xilinx XC3S200AN-5FGG676C
- Mfg. Part Number
- XC3S200AN-5FGG676C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 448 CLBs, 200000 Gates, 770MHz, CMOS, PBGA676 IC
- Datasheet Download
- XC3S200AN-5FGG676C.pdf
Availability of XC3S200AN-5FGG676C
Available Quantity
13950 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC3S200AN-5FGG676C, we specialize in Xilinx all series electronic components. XC3S200AN-5FGG676C can be shipped within 24 hours after order. If you have any demands for XC3S200AN-5FGG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC3S200AN-5FGG676C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC3S200AN-5FGG676C
| Internal Part Number | EIS-XC3S200AN-5FGG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC3S200AN-5FGG676C today | |
| Series | XC3S200AN | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 448 | |
| Number of Terminals | 676 | |
| Technology | CMOS | |
| Feature | 448 CLBS, 200000 GATES | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 27 mm | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Combinatorial Delay of a CLB-Max | 4.36 ns | |
| alternates | XC3S200AN-5FG676C-2121273571 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC3S200AN-5FGG676C | |
| Alternative Part (Replacement) | EIS-XC3S200AN-5FGG676C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC3S200AN, XC3S200AN-5FGG676C Datasheet, Xilinx Distributor | |
XC3S200AN-5FGG676C Details Description
Related parts for XC3S200AN-5FGG676C
 | 9T08052A1541DBHFT | RES SMD 1.54K OHM 0.5% 1/8W 0805 | datasheet.pdf | |
 | HCPL0611R1 | OPTOISO 3.75KV OPN COLLECTOR 8SO | datasheet.pdf | |
 | RG2012N-5621-B-T1 | RES SMD 5.62K OHM 0.1% 1/8W 0805 | datasheet.pdf | |
 | P51-1500-A-A-I12-4.5V-000-000 | SENSOR 1500PSI 1/4-18NPT .5-4.5V | datasheet.pdf | |
| A22N-PR42 | SLOW | datasheet.pdf | |
| MS27467T21F16AN | CONN HSG PLUG 16POS STRGHT PINS | datasheet.pdf | |
| A093 | FUSED TEST LEAD SET | datasheet.pdf | |
| OSTTN032920 | CON TERMINAL BLOCK SPRING CLAMP | datasheet.pdf | |
| 510-26-4400-WH-0007F | MODULAR CBL STRAIGHT 7' | datasheet.pdf | |
| 1875120000 | LSF-SMT 3.50/09/90 3.5SN BK | datasheet.pdf | |
| ATS-20A-204-C1-R0 | HEATSINK 54X54X12MM XCUT | datasheet.pdf | |
 | LTC3637EDHC#TRPBF | IC REG BUCK ADJ 1A 16DFN | datasheet.pdf |