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Xilinx XC3S200AN-5FGG676C

XC3S200AN-5FGG676C picture photo
Mfg. Part Number
XC3S200AN-5FGG676C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array, 448 CLBs, 200000 Gates, 770MHz, CMOS, PBGA676 IC
Datasheet Download
XC3S200AN-5FGG676C.pdf
Availability of XC3S200AN-5FGG676C

Available Quantity

13950 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

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EIS Components is the stocking Distributor of XC3S200AN-5FGG676C, we specialize in Xilinx all series electronic components. XC3S200AN-5FGG676C can be shipped within 24 hours after order. If you have any demands for XC3S200AN-5FGG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC3S200AN-5FGG676C Order Process
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Specifications of XC3S200AN-5FGG676C
Internal Part NumberEIS-XC3S200AN-5FGG676C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC3S200AN-5FGG676C today
SeriesXC3S200AN
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.39.00.01
Number of CLBs448
Number of Terminals676
TechnologyCMOS
Feature448 CLBS, 200000 GATES
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width27 mm
Length27 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)250
Combinatorial Delay of a CLB-Max4.36 ns
alternatesXC3S200AN-5FG676C-2121273571
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC3S200AN-5FGG676C
Alternative Part (Replacement)EIS-XC3S200AN-5FGG676C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC3S200AN, XC3S200AN-5FGG676C Datasheet, Xilinx Distributor
XC3S200AN-5FGG676C Details Description
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