Xilinx XC3S50-5FGG676C
- Mfg. Part Number
- XC3S50-5FGG676C
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Field Programmable Gate Array, 192 CLBs, 50000 Gates, PBGA676 IC
- Datasheet Download
- XC3S50-5FGG676C.pdf
Availability of XC3S50-5FGG676C
Available Quantity
8670 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XC3S50-5FGG676C, we specialize in Xilinx all series electronic components. XC3S50-5FGG676C can be shipped within 24 hours after order. If you have any demands for XC3S50-5FGG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XC3S50-5FGG676C Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XC3S50-5FGG676C
| Internal Part Number | EIS-XC3S50-5FGG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XC3S50-5FGG676C today | |
| Series | XC3S50-5 | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.39.00.01 | |
| Number of CLBs | 192 | |
| Number of Terminals | 676 | |
| Technology | - | |
| Feature | 192 CLBS, 50000 GATES | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 27 mm | |
| Length | 27 mm | |
| Moisture Sensitivity Level | 3 | |
| Peak Reflow Temperature (Cel) | 250 | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | XC3S50-5FG676C-1894407677 | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XC3S50-5FGG676C | |
| Alternative Part (Replacement) | EIS-XC3S50-5FGG676C | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XC3S50-, XC3S50-5FGG676C Datasheet, Xilinx Distributor | |
XC3S50-5FGG676C Details Description
Related parts for XC3S50-5FGG676C
 | PN3645 | TRANS PNP 60V 0.8A TO-92 | datasheet.pdf | |
 | TMS320LC546APZ-50 | IC FIXED POINT DSP 100LQFP | datasheet.pdf | |
 | CT6ETP205 | TRIMMER 2M OHM 0.5W TH | datasheet.pdf | |
 | ERJ-S12F6041U | RES SMD 6.04K OHM 1% 3/4W 1812 | datasheet.pdf | |
 | AQ12EM5R1CAJME | CAP CER 5.1PF 150V 0606 | datasheet.pdf | |
 | C0805C392K4RACTU | CAP CER 3900PF 16V X7R 0805 | datasheet.pdf | |
| RWR81NR619FRB12 | RES 0.619 OHM 1W 1% WW AXIAL | datasheet.pdf | |
| 683P3ST5 | CABLE STR-R/A 3POS MALE/FMAL 5M | datasheet.pdf | |
 | PL123-09SC-R | IC CLK MULTIPLX 1:9 134MHZ 16SOP | datasheet.pdf | |
 | 316-83-107-41-002101 | Connector Socket 7 Position 0.100" (2.54mm) Gold Through Hole | datasheet.pdf | |
| ATS-21B-170-C2-R0 | HEATSINK 30X30X15MM R-TAB T766 | datasheet.pdf | |
| 4-1190065-3 | OTHER ACCESSORIES | datasheet.pdf |