Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC56L307VF160 | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 126 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - DSP (Digital Signal Processors) | |
| Series | DSP563xx | |
| Packaging | Tray | |
| Type | Fixed Point | |
| Interface | Host Interface, SSI, SCI | |
| Clock Rate | 160MHz | |
| Non-Volatile Memory | ROM (576 B) | |
| On-Chip RAM | 576kB | |
| Voltage - I/O | 3.30V | |
| Voltage - Core | 1.80V | |
| Operating Temperature | - | |
| Mounting Type | Surface Mount | |
| Package / Case | 196-LBGA | |
| Supplier Device Package | 196-MAPBGA (15x15) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC56L307VF160 | |
| Related Links | XC56L3, XC56L307VF160 Datasheet, NXP Semiconductors/Freescale Semiconductor, Inc. Distributor | |
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