Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC5C9612BYOMR | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 30 | |
| Category | Connectors, Interconnects | |
| Family | Backplane Connectors - DIN 41612 | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC5C9612BYOMR | |
| Related Links | XC5C96, XC5C9612BYOMR Datasheet, Omron Distributor | |
![]() | RT0603BRD073K83L | RES SMD 3.83KOHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | 0011185409 | 60828B134 INSULATION PUNCH | datasheet.pdf | |
![]() | D38999/20FG16SD-LC | CONN HSG RCPT FLANGE 16POS SKT | datasheet.pdf | |
![]() | 0313.062VXP | FUSE GLASS 62MA 250VAC 3AB 3AG | datasheet.pdf | |
![]() | SST-50-W40S-F21-G2501 | BIG CHIP LED HB MODULE WHITE | datasheet.pdf | |
![]() | ELXG251VNN151MP25T | CAP ALUM 150UF 20% 250V SNAP | datasheet.pdf | |
![]() | ATS-04F-178-C3-R0 | HEATSINK 35X35X25MM R-TAB T412 | datasheet.pdf | |
![]() | ATS-06G-53-C2-R0 | HEATSINK 30X30X30MM L-TAB T766 | datasheet.pdf | |
![]() | D20419-122 | DSUB MALE SCREW LOCK ZINC X2 | datasheet.pdf | |
![]() | BFC2370GC182 | CAP FILM 1800PF 5% 630VDC RADIAL | datasheet.pdf | |
![]() | MALREKA00FE247N00K | 47UF 250V 12,5X20 | datasheet.pdf | |
![]() | XQ4062XL-3PG475M | QML High-Reliability FPGAs IC | datasheet.pdf |