Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC5VFX30T-2FFG665I | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - FPGAs (Field Programmable Gate Array) | |
Series | Virtex®-5 FXT | |
Number of LABs/CLBs | 2560 | |
Number of Logic Elements/Cells | 32768 | |
Total RAM Bits | 2506752 | |
Number of I/O | 360 | |
Number of Gates | - | |
Voltage - Supply | 0.95 V ~ 1.05 V | |
Mounting Type | Surface Mount | |
Operating Temperature | -40°C ~ 100°C | |
Package / Case | 665-BBGA, FCBGA | |
Supplier Device Package | 665-FCBGA (27x27) | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC5VFX30T-2FFG665I | |
Related Links | XC5VFX30T, XC5VFX30T-2FFG665I Datasheet, Xilinx Distributor |
![]() | A3KKB-3036G | IDC CABLE - APK30B/AE30G/APK30B | datasheet.pdf | |
![]() | PLT4I-M20 | CABLE TIE HEAVY BLACK 14.5" | datasheet.pdf | |
![]() | TA-24.000MDD-T | OSC MEMS 24.000MHZ CMOS SMD | datasheet.pdf | |
![]() | RNC50H8870DSB14 | RES 887 OHM 1/10W .5% AXIAL | datasheet.pdf | |
![]() | RN60C2052FB14 | RES 20.5K OHM 1/4W 1% AXIAL | datasheet.pdf | |
![]() | D38999/20WC98AE | CONN HSG RCPT FLANGE 10POS PIN | datasheet.pdf | |
![]() | 3004N00590002 | NON-HERMETIC THERMOSTAT | datasheet.pdf | |
![]() | CL03C120JA3GNNC | CAP CER 12PF 25V NP0 0201 | datasheet.pdf | |
![]() | NPI-15J-702SH | SENSOR PRES 1015PSI SEALED GAUGE | datasheet.pdf | |
![]() | 1945-35F | FIXED IND 680UH 115MA 13.5 OHM | datasheet.pdf | |
![]() | ATS-12D-111-C1-R1 | HEATSINK 60X40X9.5MM XCUT | datasheet.pdf | |
![]() | 562101190 | Connector Barrier Block Strip 19 Circuit 0.563" (14.30mm) | datasheet.pdf |