Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC5VLX110-1FFG676C | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| EDA / CAD Models | Download from Accelerated Designs | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex®-5 LX | |
| Number of LABs/CLBs | 8640 | |
| Number of Logic Elements/Cells | 110592 | |
| Total RAM Bits | 4718592 | |
| Number of I/O | 440 | |
| Number of Gates | - | |
| Voltage - Supply | 0.95 V ~ 1.05 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 676-BBGA, FCBGA | |
| Supplier Device Package | 676-FCBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC5VLX110-1FFG676C | |
| Related Links | XC5VLX110, XC5VLX110-1FFG676C Datasheet, Xilinx Distributor | |
![]() | 1848760000 | INSERT MALE 16P+1GND TERM BLOCK | datasheet.pdf | |
![]() | RBM15DCSN | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | TPS71913-28DRVR | IC REG LDO 1.3V/2.8V 0.2A 6SON | datasheet.pdf | |
| 2-111623-8 | CONN RCPT IDC 34POS 2MM POL GOLD | datasheet.pdf | ||
![]() | 22P5644 | PANEL INNER 56X4" WHITE | datasheet.pdf | |
![]() | RNC55H14R0DSRSL | RES 14 OHM 1/8W .5% AXIAL | datasheet.pdf | |
![]() | M5522 SL005 | CABLE 19COND 20AWG SHLD 100' | datasheet.pdf | |
![]() | 1865440000 | DEVICE MARKER ET S7-12/50-TU-A4 | datasheet.pdf | |
![]() | ATS-21H-124-C1-R0 | HEATSINK 50X50X25MM XCUT | datasheet.pdf | |
![]() | ATS-10B-35-C3-R0 | HEATSINK 36.83X57.6X5.84MM T412 | datasheet.pdf | |
![]() | R5F56316CDFP#V0 | IC MCU FLASH | datasheet.pdf | |
![]() | 337SML025MD10 | CAP ALUM 330UF 20% 25V SMD | datasheet.pdf |