Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX100T-3FGG900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LXT | |
| Number of LABs/CLBs | 7911 | |
| Number of Logic Elements/Cells | 101261 | |
| Total RAM Bits | 4939776 | |
| Number of I/O | 498 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX100T-3FGG900I | |
| Related Links | XC6SLX100, XC6SLX100T-3FGG900I Datasheet, Xilinx Distributor | |
![]() | EBM15DCWD | CONN EDGECARD 30POS DIP .156 SLD | datasheet.pdf | |
![]() | RYM24DTBD | CONN EDGECARD 48POS R/A .156 SLD | datasheet.pdf | |
![]() | TLK2201AIRCP | IC ETHRNT XCVR 1-1.6GBPS 64HVQFP | datasheet.pdf | |
![]() | 170M4389 | FUSE 200A 1250V 1BKN/75 AR CU | datasheet.pdf | |
![]() | MOV-10D781K | VARISTOR 702V 2.5KA DISC 10MM | datasheet.pdf | |
![]() | RMCP2010FT61R9 | RES SMD 61.9 OHM 1% 1W 2010 | datasheet.pdf | |
| UWG1E470MCL1GS | CAP ALUM 47UF 20% 25V SMD | datasheet.pdf | ||
![]() | VE-BTZ-IV-F4 | CONVERTER MOD DC/DC 2V 60W | datasheet.pdf | |
![]() | SBH31-NBPB-D04-SP-BK | CONN HEADER .050" 8POS | datasheet.pdf | |
![]() | ATS-03C-180-C1-R0 | HEATSINK 35X35X35MM R-TAB | datasheet.pdf | |
![]() | L717TWC21WA4PFM | D-Sub Connector Plug, Male Pins 21 (17 + 4 Power) Position Free Hanging (In-Line) Solder Cup | datasheet.pdf | |
![]() | 868021-1 | 6 POS PLUG ASY W/FLY LEADS | datasheet.pdf |