Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX150-3FG900I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 27 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 11519 | |
| Number of Logic Elements/Cells | 147443 | |
| Total RAM Bits | 4939776 | |
| Number of I/O | 576 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 900-BBGA | |
| Supplier Device Package | 900-FBGA (31x31) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX150-3FG900I | |
| Related Links | XC6SLX15, XC6SLX150-3FG900I Datasheet, Xilinx Distributor | |
![]() | 101-0815 | CARD CPU SR9100 512K SRAM | datasheet.pdf | |
![]() | WD2FE01GX809-667G-HE | MODULE DDR2-667 1GB 240-FBDIMM | datasheet.pdf | |
![]() | LA15QS4004 | FUSE SEMICONDUCTOR 400A 150VAC | datasheet.pdf | |
![]() | 08-6625-70 | 625 DIP HDR SCRW MACH CONTACT | datasheet.pdf | |
![]() | 77311-802-31LF | BERGSTIK | datasheet.pdf | |
![]() | ATS-19F-192-C1-R0 | HEATSINK 45X45X35MM R-TAB | datasheet.pdf | |
![]() | L77DBG25S | D-Sub Connector Receptacle, Female Sockets 25 Position Free Hanging (In-Line) Solder | datasheet.pdf | |
![]() | TS03715D00J0G | 500 TB PLU PLU WF HOOK/B | datasheet.pdf | |
![]() | 55/0112-24-9 | CABLE STRANDED | datasheet.pdf | |
![]() | STB02-BLANK-1 | MARKERS | datasheet.pdf | |
![]() | BLM21A601SP | Capacitors Inductors Filters... | datasheet.pdf | |
![]() | 1G96FA6F00K00 | Capacitors Inductors Filters... | datasheet.pdf |