Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX75-N3FG484I | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| Standard Package | 60 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 5831 | |
| Number of Logic Elements/Cells | 74637 | |
| Total RAM Bits | 3170304 | |
| Number of I/O | 280 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 484-BBGA | |
| Supplier Device Package | 484-FBGA (23x23) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX75-N3FG484I | |
| Related Links | XC6SLX75, XC6SLX75-N3FG484I Datasheet, Xilinx Distributor | |
![]() | 0805-3N0K | FIXED IND 3NH 800MA 60 MOHM SMD | datasheet.pdf | |
![]() | EBC60DRTH | CONN EDGECARD 120PS DIP .100 SLD | datasheet.pdf | |
![]() | AN26210A-PB | IC LNA DUAL BAND W-CDMA | datasheet.pdf | |
![]() | T211MH9V3BE | SWITCH TOGGLE SP3T 0.4VA 20V | datasheet.pdf | |
![]() | PGA112EVM | EVAL MODULE FOR PGA112 | datasheet.pdf | |
![]() | OSTT7150150 | TERM BLOCK RISING CLAMP 15POS | datasheet.pdf | |
![]() | VI-J0F-MX-F2 | CONVERTER MOD DC/DC 72V 75W | datasheet.pdf | |
![]() | RWR78N3R57FSB12 | RES 3.57 OHM 10W 1% WW AXIAL | datasheet.pdf | |
![]() | MS27467T13B35JA-LC | CONN HSG PLUG STRGHT 22POS SKT | datasheet.pdf | |
![]() | LEL111-35366-1-V | CIR BRKR MAG-HYDR LEVER | datasheet.pdf | |
![]() | ATS-PCBT1081 | HEATSINK TO-220 W/TAB BLACK | datasheet.pdf | |
![]() | SIT8008AIR2-18E | OSC MEMS PROG 3.2X2.5MM 1.8V | datasheet.pdf |