Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6SLX75-N3FGG676I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Production Status (Lifecycle) | Obsolete / Discontinued | |
| Condition | New & Unused, Original Sealed | |
| PCN Design/Specification | FG(G) and BG(G) Wire Bond 25/Jan/2013 | |
| Standard Package | 40 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Spartan® 6 LX | |
| Number of LABs/CLBs | 5831 | |
| Number of Logic Elements/Cells | 74637 | |
| Total RAM Bits | 3170304 | |
| Number of I/O | 408 | |
| Number of Gates | - | |
| Voltage - Supply | 1.14 V ~ 1.26 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | -40°C ~ 100°C | |
| Package / Case | 676-BGA | |
| Supplier Device Package | 676-FBGA (27x27) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6SLX75-N3FGG676I | |
| Related Links | XC6SLX75-, XC6SLX75-N3FGG676I Datasheet, Xilinx Distributor | |
![]() | LMH6560MA/NOPB | IC OPAMP BUFFER 680MHZ 14SOIC | datasheet.pdf | |
![]() | P10-P55-L | TERM PIN NON INS 12-10AWG | datasheet.pdf | |
![]() | FJX733RTF | TRANS PNP 50V 0.15A SOT-323 | datasheet.pdf | |
![]() | CD74HC251M96 | IC 8-IN MUX TRI-ST HS 16SOIC | datasheet.pdf | |
![]() | XA3S700A-4FGG400Q | IC FPGA 311 I/O 400FBGA | datasheet.pdf | |
![]() | 1778829 | TERM BLOCK HDR 8POS R/A 2.5MM | datasheet.pdf | |
![]() | MKJ3A6W7-10PN | CONN PLUG 10POS STRGHT W/PINS | datasheet.pdf | |
![]() | 0758362124 | CONN HEADER BACKPLANE 60POS GOLD | datasheet.pdf | |
![]() | 156.5677.5801 | FUSE STRIP HSB 80A 100 PC | datasheet.pdf | |
![]() | M55342K06B2B55PWS | RES SMD 2.55KOHM 0.1% 0.15W 0805 | datasheet.pdf | |
![]() | U25J61Z3QE22 | SWITCH ROCKER DPDT 5A 120V | datasheet.pdf | |
![]() | ATS-10G-38-C1-R0 | HEATSINK 36.83X57.6X22.86MM | datasheet.pdf |