Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-XC6VHX380T-3FF1155C | |
| Lead Free Status / RoHS Status | Contains lead / RoHS non-compliant | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Assembly/Origin | Substrate Supplier Addition 03/Nov/2014 | |
| Standard Package | 1 | |
| Category | Integrated Circuits (ICs) | |
| Family | Embedded - FPGAs (Field Programmable Gate Array) | |
| Series | Virtex® 6 HXT | |
| Number of LABs/CLBs | 29880 | |
| Number of Logic Elements/Cells | 382464 | |
| Total RAM Bits | 28311552 | |
| Number of I/O | 440 | |
| Number of Gates | - | |
| Voltage - Supply | 0.95 V ~ 1.05 V | |
| Mounting Type | Surface Mount | |
| Operating Temperature | 0°C ~ 85°C | |
| Package / Case | 1156-BBGA, FCBGA | |
| Supplier Device Package | 1156-FCBGA (35x35) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | XC6VHX380T-3FF1155C | |
| Related Links | XC6VHX380, XC6VHX380T-3FF1155C Datasheet, Xilinx Distributor | |
![]() | TNPW04028K06BETD | RES SMD 8.06KOHM 0.1% 1/16W 0402 | datasheet.pdf | |
![]() | S-817B33AY-B-G | IC REG LDO 3.3V 50MA TO92-3 | datasheet.pdf | |
![]() | FXO-HC735-59.9824 | OSC XO 59.9824MHZ HCMOS SMD | datasheet.pdf | |
| M1AGL600V5-FG144I | IC FPGA 97 I/O 144FBGA | datasheet.pdf | ||
![]() | 0015911103 | CONN HEADER 10POS GOLD SMD | datasheet.pdf | |
![]() | 721-2 | PUNCH RD 2.000 CONDUIT | datasheet.pdf | |
![]() | ADP5100 | SENSOR PRESSURE 100KPA STD DIP | datasheet.pdf | |
![]() | 09400060512 | CONN HOOD SIDE ENTRY SZ6B PG21 | datasheet.pdf | |
![]() | V230LT40CPX10 | VARISTOR 324V 10KA DISC 20MM | datasheet.pdf | |
![]() | TPS657095YFFT | PMU-EMBED CAM MOD W/PRIVACY LED, | datasheet.pdf | |
| F862BY474K310Z | CAP FILM 0.47UF 10% 630VDC RAD | datasheet.pdf | ||
![]() | 860040875005 | CAP 100 UF 20% 100 V | datasheet.pdf |