Xilinx XC73108-10BG225C

XC73108-10BG225C picture photo
Mfg. Part Number
XC73108-10BG225C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
OT PLD, 25ns, 108-Cell, CMOS, PBGA225 IC
Datasheet Download
XC73108-10BG225C.pdf
Availability of XC73108-10BG225C

Available Quantity

14530 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XC73108-10BG225C, we specialize in Xilinx all series electronic components. XC73108-10BG225C can be shipped within 24 hours after order. If you have any demands for XC73108-10BG225C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XC73108-10BG225C Order Process
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Specifications of XC73108-10BG225C
Internal Part NumberEIS-XC73108-10BG225C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XC73108-10BG225C today
SeriesXC73108-
Lifecycle statusDiscontinued
RoHS StatusContact us
HTS Code8542.39.00.01
Number of CLBs-
Number of Terminals225
TechnologyCMOS
Feature12 DEDICATED INPUTS, 78 I/O
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width27 mm
Length27 mm
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)-
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XC73108-10BG225C
Alternative Part (Replacement)EIS-XC73108-10BG225C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXC73108-, XC73108-10BG225C Datasheet, Xilinx Distributor
XC73108-10BG225C Details Description
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