Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-XC7Z030-1FBG676C | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
Production Status (Lifecycle) | In Production | |
Condition | New & Unused, Original Sealed | |
Product Training Modules | Powering Series 7 Xilinx FPGAs with TI Power Management Solutions | |
Featured Product | Zynq®-7 SoC | |
PCN Design/Specification | Zynq-7000 Datasheet Update 02/Jun/2014 Zynq-7000 AP Requirement 28/Sep/2015 | |
PCN Assembly/Origin | Additional Wafer Fabrication 16/Dec/2013 Substrate Supplier Addition 03/Nov/2014 | |
Standard Package | 1 | |
Category | Integrated Circuits (ICs) | |
Family | Embedded - System On Chip (SoC) | |
Series | Zynq®-7000 | |
Packaging | Tray | |
Architecture | MCU, FPGA | |
Core Processor | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | |
MCU Flash | - | |
MCU RAM | 256KB | |
Peripherals | DMA | |
Connectivity | CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | |
Speed | 667MHz | |
Primary Attributes | Kintex™-7 FPGA, 125K Logic Cells | |
Operating Temperature | 0°C ~ 85°C | |
Package / Case | 676-BBGA, FCBGA | |
Supplier Device Package | 676-FCBGA (27x27) | |
Number of I/O | 130 | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | XC7Z030-1FBG676C | |
Related Links | XC7Z030-, XC7Z030-1FBG676C Datasheet, Xilinx Distributor |
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