Xilinx XCE7K325T-1FBG900I

XCE7K325T-1FBG900I picture photo
Mfg. Part Number
XCE7K325T-1FBG900I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array, 25475 CLBs, PBGA900 IC
Datasheet Download
XCE7K325T-1FBG900I.pdf
Availability of XCE7K325T-1FBG900I

Available Quantity

9920 Pieces

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Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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EIS Components is the stocking Distributor of XCE7K325T-1FBG900I, we specialize in Xilinx all series electronic components. XCE7K325T-1FBG900I can be shipped within 24 hours after order. If you have any demands for XCE7K325T-1FBG900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCE7K325T-1FBG900I Order Process
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Specifications of XCE7K325T-1FBG900I
Internal Part NumberEIS-XCE7K325T-1FBG900I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCE7K325T-1FBG900I today
SeriesXCE7K325T
Lifecycle statusActive
RoHS StatusRoHS compliant
HTS Code8542.39.00.01
Number of CLBs25475
Number of Terminals900
Technology-
Feature25475 CLBS
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width31 mm
Length31 mm
Moisture Sensitivity Level4
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max0.74 ns
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCE7K325T-1FBG900I
Alternative Part (Replacement)EIS-XCE7K325T-1FBG900I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCE7K325T, XCE7K325T-1FBG900I Datasheet, Xilinx Distributor
XCE7K325T-1FBG900I Details Description
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