Xilinx XCZU17EG-1FFVD1760I

XCZU17EG-1FFVD1760I picture photo
Mfg. Part Number
XCZU17EG-1FFVD1760I
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Microprocessor Circuit, CMOS, PBGA1760 IC
Datasheet Download
XCZU17EG-1FFVD1760I.pdf
Availability of XCZU17EG-1FFVD1760I

Available Quantity

10770 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
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Our Price
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EIS Components is the stocking Distributor of XCZU17EG-1FFVD1760I, we specialize in Xilinx all series electronic components. XCZU17EG-1FFVD1760I can be shipped within 24 hours after order. If you have any demands for XCZU17EG-1FFVD1760I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XCZU17EG-1FFVD1760I Order Process
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Specifications of XCZU17EG-1FFVD1760I
Internal Part NumberEIS-XCZU17EG-1FFVD1760I
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XCZU17EG-1FFVD1760I today
SeriesXCZU17EG-1
Lifecycle statusActive-Unconfirmed
RoHS StatusRoHS compliant
HTS Code8542.31.00.01
Number of CLBs-
Number of Terminals1760
TechnologyCMOS
Feature-
Package CodeBGA
Package ShapeSQUARE
Package StyleGRID ARRAY Meter
Surface MountYES
Width42.5 mm
Length42.5 mm
Moisture Sensitivity Level-
Peak Reflow Temperature (Cel)NOT SPECIFIED
Combinatorial Delay of a CLB-Max-
alternates-
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XCZU17EG-1FFVD1760I
Alternative Part (Replacement)EIS-XCZU17EG-1FFVD1760I
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXCZU17EG-, XCZU17EG-1FFVD1760I Datasheet, Xilinx Distributor
XCZU17EG-1FFVD1760I Details Description
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