Xilinx XCZU19EG-2FFVC1760I
- Mfg. Part Number
- XCZU19EG-2FFVC1760I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA1760 IC
- Datasheet Download
- XCZU19EG-2FFVC1760I.pdf
Availability of XCZU19EG-2FFVC1760I
Available Quantity
10830 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU19EG-2FFVC1760I, we specialize in Xilinx all series electronic components. XCZU19EG-2FFVC1760I can be shipped within 24 hours after order. If you have any demands for XCZU19EG-2FFVC1760I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU19EG-2FFVC1760I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU19EG-2FFVC1760I
| Internal Part Number | EIS-XCZU19EG-2FFVC1760I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU19EG-2FFVC1760I today | |
| Series | XCZU19EG-2 | |
| Lifecycle status | Active-Unconfirmed | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 1760 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 42.5 mm | |
| Length | 42.5 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU19EG-2FFVC1760I | |
| Alternative Part (Replacement) | EIS-XCZU19EG-2FFVC1760I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU19EG-, XCZU19EG-2FFVC1760I Datasheet, Xilinx Distributor | |
XCZU19EG-2FFVC1760I Details Description
Related parts for XCZU19EG-2FFVC1760I
 | E3F2-7C4-C | SENSOR PHOTO M18 NPN THRU DC | datasheet.pdf | |
| 298G3 | CONNECTOR POWER ADAPTER BRITISH | datasheet.pdf | |
 | NSBC143ZPDXV6T1G | TRANS PREBIAS NPN/PNP SOT563 | datasheet.pdf | |
 | MAX1104EUA+ | IC CODEC 8BIT 8-UMAX | datasheet.pdf | |
 | DRV593VFP | IC PWM PWR DRVR HI-EFF 32-HLQFP | datasheet.pdf | |
| 0760555103 | CONN HEADER BP 150POS 10COL GOLD | datasheet.pdf | |
 | FP-301VW-3-BLACK-50' | HEAT SHRINK FPVW 3 BLACK 50' | datasheet.pdf | |
 | 3M 4926 CIRCLE-0.75 | 3M 4926 VHB 3/4" CIR -250/PACK | datasheet.pdf | |
| ECC43DCBD | CONN EDGECARD 86POS .100" | datasheet.pdf | |
| SFM210-LPPE-D24-ST-BK | Connector Header 48 Position 0.039" (1.00mm) Gold Through Hole | datasheet.pdf | |
 | 67F120-0364 | THERMOSTAT 120 DEG NO TO-220 | datasheet.pdf | |
 | AD9713BSQ/883B | 12-Bit, 100 MSPS D/A Converters IC | datasheet.pdf |