Xilinx XCZU9CG-1FFVB1156I
- Mfg. Part Number
- XCZU9CG-1FFVB1156I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA1156 IC
- Datasheet Download
- XCZU9CG-1FFVB1156I.pdf
Availability of XCZU9CG-1FFVB1156I
Available Quantity
10500 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU9CG-1FFVB1156I, we specialize in Xilinx all series electronic components. XCZU9CG-1FFVB1156I can be shipped within 24 hours after order. If you have any demands for XCZU9CG-1FFVB1156I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU9CG-1FFVB1156I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU9CG-1FFVB1156I
| Internal Part Number | EIS-XCZU9CG-1FFVB1156I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU9CG-1FFVB1156I today | |
| Series | XCZU9CG-1 | |
| Lifecycle status | Active | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 1156 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | 35 mm | |
| Length | 35 mm | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU9CG-1FFVB1156I | |
| Alternative Part (Replacement) | EIS-XCZU9CG-1FFVB1156I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU9CG-1, XCZU9CG-1FFVB1156I Datasheet, Xilinx Distributor | |
XCZU9CG-1FFVB1156I Details Description
Related parts for XCZU9CG-1FFVB1156I
 | ERJ-3GEYJ222V | RES SMD 2.2K OHM 5% 1/10W 0603 | datasheet.pdf | |
 | 123NQ080 | DIODE MODULE 80V 120A HALF-PAK | datasheet.pdf | |
 | PE-53932SNLT | FIXED IND 37UH 2.24A 100 MOHM | datasheet.pdf | |
 | RNC50H8061FSR36 | RES 8.06K OHM 1/10W 1% AXIAL | datasheet.pdf | |
| 3280-8PG-318 | CONN PLUG 8POS INLINE PIN | datasheet.pdf | |
 | MBR12060CT | DIODE MODULE 60V 120A 2TOWER | datasheet.pdf | |
.jpg) | CL02A102KP2NNNE | CAP CER 1000PF 10V X5R 01005 | datasheet.pdf | |
| 09A30-01-2-06S | SWITCH ROTARY 2P 6POS SHORT | datasheet.pdf | |
| ED20315000J0G | 381 TB RIS CLA 180D SOL | datasheet.pdf | |
| VJ0805D101KLBAR | CAP CER 100PF 100V NP0 0805 | datasheet.pdf | |
| GTC030R20-23P | GT 2C 2#8 PIN RECP WALL RM | datasheet.pdf | |
 | LDB311G8020C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |