Xilinx XCZU9CG-L1FFVC900I
- Mfg. Part Number
- XCZU9CG-L1FFVC900I
- Manufacturer
- Xilinx
- Product Category
- XILINX CPLD FPGA IC
- Brief Description
- Microprocessor Circuit, CMOS, PBGA900 IC
- Datasheet Download
- XCZU9CG-L1FFVC900I.pdf
Availability of XCZU9CG-L1FFVC900I
Available Quantity
7070 Pieces
Can ship today
Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
- Marketing Price
- N/A
- Our Price
- Quote by Email
EIS Components is the stocking Distributor of XCZU9CG-L1FFVC900I, we specialize in Xilinx all series electronic components. XCZU9CG-L1FFVC900I can be shipped within 24 hours after order. If you have any demands for XCZU9CG-L1FFVC900I, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
- XCZU9CG-L1FFVC900I Order Process
- Add Parts to RFQ form
- Submit RFQ
- We reply within 24 hours
- You confirm order
- Payment
- Ship out your order
Specifications of
XCZU9CG-L1FFVC900I
| Internal Part Number | EIS-XCZU9CG-L1FFVC900I | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 6 (Time on Label) | |
| Production Status (Lifecycle) | Contact us to see if it's obsolete now | |
| Condition | NEW AND UNUSED, Original made by XILINX | |
| Delivery Time | In stock, ship XCZU9CG-L1FFVC900I today | |
| Series | XCZU9CG-L | |
| Lifecycle status | Active-Unconfirmed | |
| RoHS Status | RoHS compliant | |
| HTS Code | 8542.31.00.01 | |
| Number of CLBs | - | |
| Number of Terminals | 900 | |
| Technology | CMOS | |
| Feature | - | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY Meter | |
| Surface Mount | YES | |
| Width | - | |
| Length | - | |
| Moisture Sensitivity Level | - | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Combinatorial Delay of a CLB-Max | - | |
| alternates | - | |
| Marking / Symbol | Email us | |
| Voltage - Supply | - | |
| Operating Temperature | - | |
| Packaging | Tray / Tape and Reel / Tube | |
| SPQ MOQ | 1 Piece | |
| Application | Military or Industrial for XCZU9CG-L1FFVC900I | |
| Alternative Part (Replacement) | EIS-XCZU9CG-L1FFVC900I | |
| Country of Origin | USA TAIWAN KOREA | |
| Weight | 0.005KG | |
| Additional Services | Programming and tape packing or testing | |
| Distributor | EIS LIMITED | |
| Related Links | XCZU9CG-L, XCZU9CG-L1FFVC900I Datasheet, Xilinx Distributor | |
XCZU9CG-L1FFVC900I Details Description
Related parts for XCZU9CG-L1FFVC900I
 | P51-75-G-T-D-5V-000-000 | SENSOR 75PSI 7/16-20-2B 1-5V | datasheet.pdf | |
 | CY62167EV30LL-45BVI | IC SRAM 16MBIT 45NS 48VFBGA | datasheet.pdf | |
| B41042A2107M | CAP ALUM 100UF 20% 6.3V RADIAL | datasheet.pdf | |
| 1658-G21-00-P13-6A | CIR BRKR THRM 6A 240VAC 28VDC | datasheet.pdf | |
 | PUZ3-D48-D12-D | CONVERT DC/DC 3W 12V 125MA OUT | datasheet.pdf | |
| 851-83-014-40-001101 | Connector Socket 14 Position 0.050" (1.27mm) Gold Surface Mount, Right Angle | datasheet.pdf | |
| 1537R-44K | FIXED IND 22UH 202MA 2.5 OHM TH | datasheet.pdf | |
| 78998-416HLF | HEADER BERGSTIK | datasheet.pdf | |
| ATS-17G-83-C3-R0 | HEATSINK 30X30X30MM R-TAB T412 | datasheet.pdf | |
| ATS-06D-154-C3-R0 | HEATSINK 40X40X15MM L-TAB T412 | datasheet.pdf | |
| MDM-100SH008B-A174 | MICRO 100C S 12" WHT NI | datasheet.pdf | |
 | TLZ4V7C-GS18 | DIODE ZENER 4.7V 500MW SOD80 | datasheet.pdf |