Xilinx XQ6SLX75-1LFG676C

XQ6SLX75-1LFG676C picture photo
Mfg. Part Number
XQ6SLX75-1LFG676C
Manufacturer
Product Category
XILINX CPLD FPGA IC
Brief Description
Field Programmable Gate Array IC
Datasheet Download
XQ6SLX75-1LFG676C.pdf
Availability of XQ6SLX75-1LFG676C

Available Quantity

8520 Pieces

Can ship today


Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks

Marketing Price
N/A
Our Price
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QUANTITY

 

EIS Components is the stocking Distributor of XQ6SLX75-1LFG676C, we specialize in Xilinx all series electronic components. XQ6SLX75-1LFG676C can be shipped within 24 hours after order. If you have any demands for XQ6SLX75-1LFG676C, Please kindly submit an RFQ here or send us an email. We will reply you as soon as possible.
XQ6SLX75-1LFG676C Order Process
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Specifications of XQ6SLX75-1LFG676C
Internal Part NumberEIS-XQ6SLX75-1LFG676C
Lead Free Status / RoHS StatusLead free / RoHS Compliant
Moisture Sensitivity Level (MSL)6 (Time on Label)
Production Status (Lifecycle)Contact us to see if it's obsolete now
ConditionNEW AND UNUSED, Original made by XILINX
Delivery TimeIn stock, ship XQ6SLX75-1LFG676C today
SeriesXQ6SLX75-
Lifecycle statusActive-Unconfirmed
RoHS StatusContact us
HTS Code8542.39.00.01
Number of CLBs-
Number of Terminals-
Technology-
Feature-
Package Code-
Package Shape-
Package Style-
Surface Mount-
Width-
Length-
Moisture Sensitivity Level3
Peak Reflow Temperature (Cel)225
Combinatorial Delay of a CLB-Max-
alternatesXQ6SLX75-1LFGG676C-1157845477
Marking / SymbolEmail us
Voltage - Supply-
Operating Temperature-
PackagingTray / Tape and Reel / Tube
SPQ MOQ1 Piece
ApplicationMilitary or Industrial for XQ6SLX75-1LFG676C
Alternative Part (Replacement)EIS-XQ6SLX75-1LFG676C
Country of OriginUSA TAIWAN KOREA
Weight0.005KG
Additional ServicesProgramming and tape packing or testing
DistributorEIS LIMITED
Related LinksXQ6SLX75, XQ6SLX75-1LFG676C Datasheet, Xilinx Distributor
XQ6SLX75-1LFG676C Details Description
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