Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-Y16286K60257T9W | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Standard Package | 1,000 | |
| Category | Resistors | |
| Family | Chip Resistor - Surface Mount | |
| Series | VSMP | |
| Packaging | Tray - Waffle | |
| Resistance (Ohms) | 6.60257k | |
| Tolerance | ±0.01% | |
| Power (Watts) | 0.75W, 3/4W | |
| Composition | Metal Foil | |
| Features | Moisture Resistant, Non-Inductive | |
| Temperature Coefficient | ±0.2ppm/°C | |
| Operating Temperature | -55°C ~ 150°C | |
| Package / Case | 2512 (6432 Metric) | |
| Supplier Device Package | 2512 | |
| Size / Dimension | 0.249" L x 0.127" W (6.32mm x 3.23mm) | |
| Height | 0.025" (0.64mm) | |
| Number of Terminations | 2 | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | Y16286K60257T9W | |
| Related Links | Y16286K, Y16286K60257T9W Datasheet, Vishay Foil Resistors (Division of Vishay Precision Group) Distributor | |
![]() | EXB-E10C682J | RES ARRAY 8 RES 6.8K OHM 1608 | datasheet.pdf | |
![]() | PIC17C44-16E/PQ | IC MCU 8BIT 16KB OTP 44MQFP | datasheet.pdf | |
![]() | U2794B-NFSG3H | IC DEMODULATOR QUAD 1KHZ 20SSO | datasheet.pdf | |
![]() | HMC26DRXN | CONN EDGECARD 52POS DIP .100 SLD | datasheet.pdf | |
![]() | GBM10DTBN-S273 | CONN EDGECARD 20POS R/A .156 SLD | datasheet.pdf | |
![]() | 0011184811 | COMPRESSION SPRING 60800A107 | datasheet.pdf | |
![]() | KPSE07E22-55PZ | CONN RCPT 55POS JAM NUT W/PINS | datasheet.pdf | |
![]() | RT8020BGQW | IC REG BUCK 1.3V/3.3V DL 12WDFN | datasheet.pdf | |
![]() | CL03C2R2CA3GNNC | CAP CER 2.2PF 25V NP0 0201 | datasheet.pdf | |
![]() | 1169930000 | CONN HSG INSERT SHELL M23 RA | datasheet.pdf | |
![]() | CTV07RW-11-99SE-LC | CTV 7C 7#20 SKT J/N RECP | datasheet.pdf | |
![]() | 1-1102363-2 | HB.32.SGD-LB.2.29 | datasheet.pdf |