1.5W and 3W non-encapsulated dc-dc converters

TDK-Lambda has extended its CCG series of dc-dc converters further downward with the introduction of 3W and 1.5W models – in 2015 there were 30W CCG converters, reaching 15W the next year.

This article was posted on Mar 10, 2022

Chiplet consortium to develop packaging standard

Intel, TSMC, Samsung, Qualcomm, ASE, AMD, Arm, Google Cloud, Microsoft and Meta are to pursue a die-to-die interconnect packaging standard called Universal Chiplet Interconnect Express (UCIe).

This article was posted on Mar 10, 2022

Ice Lake-D on COM Express basic type 7

Kontron has adopted Intel Ice Lake-D processors for a COM Express basic type 7 computer-on-modules, and has an evaluation carrier board to go with them.

This article was posted on Mar 10, 2022

Open standard for RISC-V verification is announced at DVCon

At this year’s (virtual) functional design and verification conference, DVCon US 2022, the RISC-V Verification Interface (RVVI) was announced by Imperas Software. The interface is available at github.

This article was posted on Mar 10, 2022

800Gbit/s optical demo by AMD and Ranovus

Aiming at data centres, Ranovus and AMD are demonstrating 800Gbit/s optical comms at OFC 2022.

This article was posted on Mar 10, 2022

Graphcore adds WoW to IPU

By moving its 7nm IPU to TSMC’s Wafer-on-Wafer technology, Graphcore has increased its performance by up to 40% and its power efficiency by 16%, says the company.

This article was posted on Mar 10, 2022

Ukraine invasion fallout blocks OneWeb satellite launches

OneWeb, the satellite company partly-owned by the UK government, is involved in a Ukraine-related row with the Russian-operated Baikonur spaceport, which has been used for launching its constellation.

This article was posted on Mar 10, 2022

NTT-DOCOMO to present on O-RAN at MWC

NTT-DOCOMO to present on O-RAN at MWC

This article was posted on Mar 7, 2022

Intel chooses Magdeburg for European fab site

Intel has chosen Magdeburg in eastern Germany as its European fab site, reports Reuters.

This article was posted on Mar 7, 2022

Arm clears out top management

Four out of the top seven executives of Arm have now left the company following a clear-out by new CEO Rene Haas.

This article was posted on Mar 7, 2022

ISSCC 2022: MEMS senses zeptograms

Zeptogram’ caught the eye at ISSCC 2022 conference last week, as researchers from French lab CEA-Leti produced a mass sensor with 170zg resolution for weighing molecules.

This article was posted on Mar 7, 2022

Nasa opens Phase 2 of $5m Lunar Power Prize Competition

Nasa has opened the Second Phase of its $5 million Lunar Power Prize Competition, which is dubbed Watts On The Moon.

This article was posted on Mar 7, 2022

EW BrightSparks winner wins WorldSkills UK ‘Rising Star’ award

Leonardo Electronics Engineer Anna Hart has won the WorldSkills UK’s Equity, Diversity and Inclusion ‘Rising Star’ award.

This article was posted on Mar 7, 2022

Toshiba TVS diode has capacitance of 0.12pF

Toshiba has started shipping a low capacitance TVS diode.

This article was posted on Mar 7, 2022

ADI hooks up with STL for O-RAN

ADI and Systems integrator STL are joining up to co-develop 5G ORAN radio units (O-RU).

This article was posted on Mar 7, 2022

Toshiba CEO resigns

Toshiba’s CEO Satoshi Tsunakawa (pictured) and his deputy Mamieu Hatazawa resigned earlier today amid the furore over plans to re-structure the company.

This article was posted on Mar 7, 2022

Lockheed Martin to prototype next-generation US Marine 5G comms

The US Department of Defense (DOD) has awarded Lockheed Martin a $19.3m contract to create a 5G communications network infrastructure testbed for the US Marine Corps.

This article was posted on Mar 2, 2022

Intel sets out its stall

Intel laid down some product targets at its Investor Day.

This article was posted on Mar 2, 2022

Automotive MCUs for SiC charging

STMicroelectronics has announced a microcontroller for electric vehicle on-board chargers, particularly those using silicon carbide power components.

This article was posted on Mar 2, 2022

Satellite Vu trusts SpaceX for thermal imaging satellite launch

The UK satellite company Satellite Vu, which aims to monitor the thermal footprint of any building on the planet, has turned to SpaceX for the launch of what it describes as the world’s highest resolution thermal imaging satellite.

This article was posted on Mar 2, 2022

Rohde & Schwarz and Viavi team up for O-RAN interoperability testing

Rohde & Schwarz (R&S) and Viavi have got together to offer an integrated solution for conformance testing of O-RAN Radio Units (O-RUs).

This article was posted on Mar 2, 2022