Pi Day Design Challenge
In celebration of Pi Day, element14.com has launched the Raspberry Pi Pi-Fest Design Challenge.
This article was posted on Mar 28, 2022MathWorks updates MATLAB and Simulink
MathWorks has released 2022a of the MATLAB and Simulink product families.
This article was posted on Mar 28, 2022Digi-Key to host Private LoRaWAN for IoT webinar
Digi-Key Electronics, along with Machinechat and Seeed Studio, will host a webinar on Private LoRaWAN projects, dubbed ‘How to build and deploy a private LoRaWAN IoT project within days’.
This article was posted on Mar 28, 2022Softbank Vision Fund sells Cruise stake to GM
GM is buying the Softbank Vision Fund’s stake in Cruise for €2.1 billion.
This article was posted on Mar 28, 2022APEC week: NXP and Hitachi collaborate on SIC power stage for vehicle traction inverters
NXP and Hitachi have co-designed a gate driver evaluation board for Hitachi’s 1.2kV RoadPak SiC mosfet half-bridges.
This article was posted on Mar 28, 2022Founder of AFBE-UK boosts EW BrightSparks selection panel
We’re very pleased to announce another addition to the EW BrightSparks judging panel with Dr. Ollie Folayan, the co-founder of AFBE-UK (Association for Black and Minority Ethnic Engineers) and chair of its Scottish arm, agreeing to join us this year.
This article was posted on Mar 28, 2022APEC week: 650V SiC mosfets in 7pin D2PAK
Infineon has announced 650V silicon carbide mosfets in 7pin D2PAK surface-mount packages, aimed at servers, telecoms. electric vehicle charging and solar energy.
This article was posted on Mar 28, 2022Ten steps to designing an SoC
Sondrel has come up with a ten step guide to designing an SoC.
This article was posted on Mar 10, 2022Onsemi sells two fabs
onsemi has sold its South Portland, Maine fab to Diodes following the closure of its Oudenarde, Belgium fab last month.
This article was posted on Mar 10, 2022IGBTs in enhanced TO247
Formerly only available in modules, Infineon is now putting its EDT2 IGBTs die into individual packaging – its TO247Plus package.
This article was posted on Mar 10, 20221.5W and 3W non-encapsulated dc-dc converters
TDK-Lambda has extended its CCG series of dc-dc converters further downward with the introduction of 3W and 1.5W models – in 2015 there were 30W CCG converters, reaching 15W the next year.
This article was posted on Mar 10, 2022Chiplet consortium to develop packaging standard
Intel, TSMC, Samsung, Qualcomm, ASE, AMD, Arm, Google Cloud, Microsoft and Meta are to pursue a die-to-die interconnect packaging standard called Universal Chiplet Interconnect Express (UCIe).
This article was posted on Mar 10, 2022Ice Lake-D on COM Express basic type 7
Kontron has adopted Intel Ice Lake-D processors for a COM Express basic type 7 computer-on-modules, and has an evaluation carrier board to go with them.
This article was posted on Mar 10, 2022Open standard for RISC-V verification is announced at DVCon
At this year’s (virtual) functional design and verification conference, DVCon US 2022, the RISC-V Verification Interface (RVVI) was announced by Imperas Software. The interface is available at github.
This article was posted on Mar 10, 2022800Gbit/s optical demo by AMD and Ranovus
Aiming at data centres, Ranovus and AMD are demonstrating 800Gbit/s optical comms at OFC 2022.
This article was posted on Mar 10, 2022Graphcore adds WoW to IPU
By moving its 7nm IPU to TSMC’s Wafer-on-Wafer technology, Graphcore has increased its performance by up to 40% and its power efficiency by 16%, says the company.
This article was posted on Mar 10, 2022Ukraine invasion fallout blocks OneWeb satellite launches
OneWeb, the satellite company partly-owned by the UK government, is involved in a Ukraine-related row with the Russian-operated Baikonur spaceport, which has been used for launching its constellation.
This article was posted on Mar 10, 2022NTT-DOCOMO to present on O-RAN at MWC
NTT-DOCOMO to present on O-RAN at MWC
This article was posted on Mar 7, 2022Intel chooses Magdeburg for European fab site
Intel has chosen Magdeburg in eastern Germany as its European fab site, reports Reuters.
This article was posted on Mar 7, 2022Arm clears out top management
Four out of the top seven executives of Arm have now left the company following a clear-out by new CEO Rene Haas.
This article was posted on Mar 7, 2022ISSCC 2022: MEMS senses zeptograms
Zeptogram’ caught the eye at ISSCC 2022 conference last week, as researchers from French lab CEA-Leti produced a mass sensor with 170zg resolution for weighing molecules.
This article was posted on Mar 7, 2022