Infineon is to invest more than €2 billion building a third module at its fab site in Kulim, Malaysia to make SiC and GaN power ICs.
This article was posted on Feb 28, 2022Toshiba has introduced a mosfet load switch gate driver in a 1.2 x 0.8 x 0.35mm 6bump WCSP6G the chip-scale package, suiting it to wearables and smartphones, it said.
This article was posted on Feb 28, 2022Mornsun’s LMF500-20Bxx series of 500W ac-dc PSUs are available from Relec.
This article was posted on Feb 28, 2022Innoscience Technology, which was founded to pursue high performance, cost-effective Gallium Nitride on Silicon (GaN-on-Si) power ICs, has come up with a 40V bi-directional GaN-on-Si enhancement mode HEMT for mobile devices, including laptops and cellular phones.
This article was posted on Feb 28, 2022Anglia Components has signed a UK and Ireland distribution agreement with Chinese LED maker Ekinglux.
This article was posted on Jan 21, 2022TT Electronics has announced the debut of its HPDC series of high power density chip resistors.
This article was posted on Jan 21, 2022Dr. Katherine Calvin has been appointed NASA chief scientist and senior climate advisor, having worked at the Pacific Northwest National Laboratory’s Joint Global Change Research Institute (JGCRI).
This article was posted on Jan 21, 2022Semtech and Lacuna Space aim to extend the coverage of LoRaWAN by adding IoT-to-Satellite connectivity.
This article was posted on Jan 21, 2022Q4 PC unit shipments were down 5% y-o-y at 88.4 million units, says Gartner while, for the year, PC unit shipments reached 339.8 million units – a 9.9% increase on 2020.
This article was posted on Jan 21, 2022Berkshire-based Phabrix is manufacturing its 8,000th Sx handheld 3G-SDI tester.
This article was posted on Jan 21, 2022TSMC has set a 2022 capex budget of $40-44 billion as it expects Q1 sales of $16.6 billion to $17.2 billion and growth for the year of 15-20%.
This article was posted on Jan 21, 2022Electroninks has added gold and platinum particle-free conductive inks to its silver and copper inks.
This article was posted on Jan 21, 2022Toshiba is sampling an Ethernet bridge IC – the TC9563XBG – for use in automotive zonal-architecture, infotainment, telematics or gateways as well as industrial equipment.
This article was posted on Jan 21, 2022Astroscale U.S. has joined in partnership with Orbit Fab – the “Gas Stations in Space” refueling service provider – to provide on-orbit refueling services to Astroscales’s spacecraft.
This article was posted on Jan 21, 2022First samples of Infineon’s 28nm Aurix TC4x family of automotive MCUs are available.
This article was posted on Jan 19, 2022Sondrel, the ASIC design house, is looking to hire more Systems Architects.
This article was posted on Jan 19, 2022Allegro is claiming a record for its latest Hall-effect position sensor IC, describing it as “the smallest sine/cosine 3D sensor currently available in the market”.
This article was posted on Jan 19, 2022Tektronix has announced Version B of its 5 Series mixed-signal oscilloscopes.
This article was posted on Jan 19, 2022Siemens Digital has extended its mechanical performance prediction capabilities with Simcenter 3D 2022.1
This article was posted on Jan 19, 2022EMA Design Automation, the US EDA specialist, has merged with FlowCAD,.
This article was posted on Jan 19, 2022HawkEye 360, the space-based RF data specialists, has been awarded a three year, $15.5 million Experimental Purpose Agreement (EPA) contract with the United States Air Force Research Laboratory’s (AFRL) Space Vehicles Directorate.
This article was posted on Jan 19, 2022