Raspberry Pi CM4 industrial controllers are expandable
Sfera Labs is shipping an expandable DIN rail industrial controller, built around the Raspberry Pi Compute Module 4.
This article was posted on Jul 10, 2024NGK invests in flexi LED display start-up
NGK Insulators has invested in PanelSemi, a Taiwan-based flexible flat-panel LED display start-up.
This article was posted on Jul 10, 2024High-voltage resistors 100% screened for voltage coefficient
Stackpole is aiming at accurate high-voltage measurement with a family of resistors that are 100% tested for voltage-induced resistance variation.
This article was posted on Jul 10, 2024Circular touch display can be customised
Zytronic has introduced a round touch display module which can be mounted onto a wall or integrated into a table.
This article was posted on Jul 10, 2024Intel delays Fab 38
Intel has delayed Fab 38 in Kiryat Gap, Israel, reports Calcalist.
This article was posted on Jun 18, 2024PCIM: 50V, 8.5mΩ GaN hemp in 1.5 x 1.2mm package
EPC is aiming at USB-C PD applications 50V 8.5mΩ GaN transistor with a 1.8mm2 footprint.
This article was posted on Jun 18, 2024PCIM: 750V 4mΩ SiC jfet for circuit breakers in TOLL pacakge
Qorvo has picked depletion-mode (normally-on) silicon carbide JFET technology to build a 750V 4.3mΩ transistor for circuit breakers, and put it in a 10 x 12mm surface-mount TOLL package.
This article was posted on Jun 18, 2024PCIM: 250W smart GaN motor driver is only 12x12mm
Texas Instruments introduced a 450V intelligent power module that includes a GaN three-phase bridge for motors up to 250W.
This article was posted on Jun 18, 2024PCIM: 24 channel LED driver for vehicles
Novosense Microelectronics announced a 24 channel automotive LED driver at PCIM in Nuremberg today.
This article was posted on Jun 18, 2024Incremental encoder for small and tiny motors
CUI Devices has announced an incremental encoder for motors with shafts between 1 and 6.35mm in diameter.
This article was posted on Jun 18, 2024Raspberry Pi IPO looking good
Raspberry Pi has set a price for its IPO which will value the company at about £542 million.
This article was posted on Jun 18, 2024UK and US sign SEP MoU
A MOU signed by Under Secretary of Commerce for Intellectual Property, USPTO Director Kathi Vidal and the Chief Executive Officer of the United Kingdom Intellectual Property Office (UKIPO) Adam Williams provides a framework for collaboration between the two offices on policies relating to standard essential patents (SEPs).
This article was posted on Jun 18, 2024Airbus, Helsing team for Wingman AI unmanned platform
Airbus Defence and Space and Helsing have signed a cooperation agreement to work together on AI technologies to be used in a future Wingman system.
This article was posted on Jun 18, 2024Li-ion battery market to have 11.6% CAGR 2023-29 to reach $188bn
The Li-ion battery packs market for BEV and PHEV is forecast to grow from around $97 billion in 2023 to $188 billion by 2029, with an 11.6% CAGR between 2023 and 2029, says Yole Developpement.
This article was posted on Jun 18, 2024TME promises ‘creative adventure’ with Tech Master Event Tournament 2024
Polish electronics component distributor, TME (Transfer Multisort Elektronik) has announced this year’s Tech Master Event tournament. The tournament consists of several events and each event’s winners are eligible to progress to the main tournament event to win cash prizes.
This article was posted on May 22, 2024How cuprate superconductors might work
Diagonal hopping by electrons explains superconductivity in cuprate ‘high-temperature’ superconductors, according to researchers associated with the Flatiron Institute in New York.
This article was posted on May 22, 2024Polar Semi gets $525m investment
Polar Semiconductor is to get $120 million of US Chips Act money to double its manufacturing capacity for power chips and sensors.
This article was posted on May 22, 2024200A 50V GaN dc-dc converter for space
EPC is aiming at satellites with an application note on four-phase dc-dc point-of load converters using multiple 26 x 19mm modules.
This article was posted on May 22, 2024Adhesive bonds glass to die for image sensors
Delo has created a sealant adhesive for bonding glass filters directly on to cmos image sensor die.
This article was posted on May 22, 202480 Arm Neoverse V1 cores and in-package memory for SiPearl MCU
SiPearl has revealed some details of its AI microprocessor.
This article was posted on May 22, 2024Nisshinbo adds to Muses
Nisshinbo Micro Devices has added a dual-op amp with a J-FET input stage to to its MUSES sound series targeted at high-end home audio, professional studio equipment, car audio systems, and portable audio devices.
This article was posted on May 22, 2024