UK Government aims to make digital identities secure and legal

The Government is planning to boost the legal status of digital identities to make them “as widely recognised as driver’s licences and bank statements”, according to the Department for Digital, Culture, Media and Sport (DCMS), which is seeking “Easily recognised trust-marks to be issued for digital identity products to build public confidence.”

This article was posted on Jul 26, 2021

Rohm plans to mass produce hybrid IGBTs with integrated SiC Schottky barrier diode

ROHM intends to move into mass production of its hybrid IGBTs with integrated 650V SiC Schottky barrier diode in December.

This article was posted on Jul 26, 2021

NASA recovers Hubble Space Telescope control for science operations

NASA’s Hubble Space Telescope has been recovered to an operational status. The collection of science data will now resume, confirms the U.S. space agency.

This article was posted on Jul 26, 2021

Upward trend for DRAM ASP continuing but slowing

The QoQ increase in DRAM contract prices is expected to narrow from 18-23% in 2Q21 to 3-8% in 3Q21, says TrendForce, with a further rise in Q4.

This article was posted on Jul 22, 2021

£700k for Cyber Cluster Collaboration

The Department for Digital, Culture, Media and Sport (DCMS) has awarded £700,000 to UK Cyber Cluster Collaboration (UKC3), a network of 20 regional clusters of cyber businesses, employers and local organisations which work together to boost the UK’s cyber security sector.

This article was posted on Jul 22, 2021

Taiwan and Korea host 40% of worldwide wafer capacity

Taiwan and Korea have over 40% of the total world wafer capacity, according to IC Insights’ Global Wafer Capacity Report.

This article was posted on Jul 22, 2021

Weebit Nano tapes out test chip

Weebit Nano has completed the design and verification stages of its embedded ReRAM module, and taped-out a test-chip that integrates this module.

This article was posted on Jul 22, 2021

MikroE Dev board covers all Microchip PICs

MikroElektronika has redesigned its development board for all Microchip PIC, dsPIC, PIC24, PIC32 microcontrollers around its own interchangeable add-on board formats, including ‘SiBrain’ MCU boards.

This article was posted on Jul 22, 2021

Farnell stocks pro-grade 3D printers from BCN3D

Farnell has added professional-grade 3D printers from Barcelona-based BCN3D Technologies to its portfolio.

This article was posted on Jul 22, 2021

Northrop Grumman finalises contract for NASA Gateway habitation module

Northrop Grumman has finalised its contract with NASA to provide the Habitation and Logistics Outpost (HALO) module for NASA’s Gateway, the next-generation replacement for the International Space Station.

This article was posted on Jul 22, 2021

Skoltech, MIT and Nanyang researchers tweak semiconductor crystals on the fly

Researchers at Skoltech of Russia, MIT and Nanyang Technological University of Singapore have created a neural network that can help tweak semiconductor crystals in a controlled fashion to achieve superior properties for electronics.

This article was posted on Jul 22, 2021

NAND ASPs Trend Upwards

Contract prices of NAND Flash will rise marginally for 3Q21, with QoQ increases in the range of 5-10%, reports TrendForce. 128-layer NAND is becoming the mainstream offering.

This article was posted on Jul 22, 2021

Xilinx debuts Versal HBM

Xilinx has introduced the Versal HBM adaptive compute acceleration platform (ACAP), the newest series in the Versal portfolio.

This article was posted on Jul 22, 2021

UK Space agency seeks ideas for debris removal missions

The UK Space Agency (UKSA) has extended the deadline for its Active Debris Removal call for study proposals, with up to £800,000 in funding available to develop ideas for space debris removal missions.

This article was posted on Jul 21, 2021

Andes certifies Risc-V SIMD and DSP reference models

Risc-V core design house Andes Technology has certified reference models for its cores with ‘P’ extensions from Imperas.

This article was posted on Jul 21, 2021

Module combines GNSS and dead-reckoning at up to 105°C for automotive

U-blox is creating automotive-grade positioning modules that combine data from GNSS (satellite) and internal inertial sources.

This article was posted on Jul 21, 2021

Williams teams with Nyobolt automotive powertrain batteries

Williams Advanced Engineering (WAE) and battery start-up Nyobolt have signed a deal to create high power density batteries for automotive power trains.

This article was posted on Jul 21, 2021

Paktron Capacitors signs distribution agreement with New Yorker Electronics

Stacked multi-layer polymer (MLP) film capacitors from Paktron Capacitors are now available from distributor New Yorker Electronics, following a distribution agreement between the two companies.

This article was posted on Jul 21, 2021

Power-only USB Type C connector mounts vertically

CUI Devices has introduced a vertically-mounted power-only USB Type C connector.

This article was posted on Jul 21, 2021

Varta custom makes Li-ion cell for hearing aid

Battery specialist Varta has tailor-made a lithium-ion cell for hearing aid manufacturer Eargo, for its its smallest and most advanced hearing aid to date, the Eargo 5.

This article was posted on Jul 21, 2021

Clamp meters include electric field sensor

Fluke has introduced two true-RMS clamp meters with electric field sensing scheme branded FieldSense.

This article was posted on Jul 21, 2021