Skywater, the US DoD-backed secure fab, is to use Multibeam’s Multicolumn Electron-Beam Lithography (MEBL) system in its 45 nm process.
This article was posted on Dec 15, 2020The ultrasound sensing module market is expected to reach $6.2 billion in 2025 with a 5.1% CAGR between 2019 and 2025, says Yole Developpement.
This article was posted on Dec 15, 2020Farnell is shipping a new BBC micro:bit with extended capabilities including greater memory capacity, a faster processor and, for the first time, “out of the box” sound and touch capabilities.
This article was posted on Dec 15, 2020The PillarHall test chip for analysing 3D thin film structures is ready for market. Chipmetrics Oy, a spin-off of VTT, is now starting to commercialise the solution. The test chip enables the production of smaller nanostructures and components.
This article was posted on Dec 15, 2020The CTO of T-Mobile US, Neville Ray (pictured) has raised doubts about the management of O-RAN.
This article was posted on Dec 10, 2020Foundry revenue is projected to undergo a 23.8% increase in 2020, the highest percentage in 10 years, says TrendForce,
This article was posted on Dec 10, 2020Phoenix, Arizona is to provide $205 million in grants towards TSMC’s $12 billion 5nm fab.
This article was posted on Dec 10, 2020The Zigbee Alliance – which oversees Zigbee, the IoT-friendly wireless standard – has announced a development within the Connected Home over IP project (CHIP).
This article was posted on Dec 10, 2020Sensirion has introduced an evaluation kit for its single-use LD20-2600B liquid flow sensors, built around the Swiss company’s CMOSens-branded technology.
This article was posted on Dec 10, 2020Mythic has announced it’s Analog Matrix Processor (Mythic AMP) which delivers an analogue compute claimed to perform comparably to digital devices.
This article was posted on Dec 10, 2020Suitable for undersea power lines as well as tethered drones, the AEK 3000 HV Series is a range of adaptable high voltage DC power supplies, manufactured by Cotek and available from Relec Electronics.
This article was posted on Dec 10, 2020Analog Devices revealed details of its second generation of micromachined electro-mechanical relays for automated test.
This article was posted on Dec 10, 2020Designed specifically for production line testing of speakers, microphones, headphones, headsets and consumer products with speakers and microphones, the APx517B acoustic analyser can be used by manufacturers as an integrated acoustic test system, says Audio Precision.
This article was posted on Dec 10, 2020Harwin has introduced a 60A rated 8.5mm pitch power connector, called the Kona series.
This article was posted on Dec 10, 2020Microchip has released 8bit PIC18 MCUs that can transmit and receive data through CAN bus Flexible Data rate (CAN FD) bus.
This article was posted on Dec 9, 2020Last chance to enter: ADI is giving Electronics Weekly readers a chance to win one of three DC2629A evaluation boards as prizes, which are worth $95 each.
This article was posted on Dec 9, 2020The French union CAD has renewed its call to continue the strike at ST for Tuesday 17th and Thursday 26th of November 2020, and requests a minimum increase of 100 euros for all.
This article was posted on Dec 9, 2020Exploiting a quantum principle in a novel way, researchers at the US National Institute of Standards and Technology (NIST) have created a miniature thermometer that works below 1K with errors less that 14mK and a response time of 5ms.
This article was posted on Dec 9, 2020EDA company, Mentor, has joined Nano 2022, the latest project to promote the French electronics manufacturing industry. It covers components, connectors and PCBs, to design and assembly, distribution, embedded software and software tools. The project is part of the European Commission’s Important Project of Common European Interest (IPCEI) to promote research and innovation in power ICs, sensors, optical equipment and compound materials for automotive, security, IoT, space and avionics industries.
This article was posted on Dec 9, 2020TI and Xilinx are collaborating to build scalable and adaptable digital front-end (DFE) to increase energy efficiency of lower antenna count radios.
This article was posted on Dec 9, 2020Concurrent Technologies announce its first 3U VPX artificial intelligence accelerator board based on an Intel Arria FPGA earlier this year, developed in accordance with a proposed VITA 65.1 profile aligned with the SOSA Technical Standard, according to the company.
This article was posted on Dec 9, 2020