KEMET using KONNEKT packaging for KC-LINK range

KEMET has extended its KC-LINK range by using KONNEKT high-density packaging technology to meet demand for fast-switching wide bandgap (WBG) semiconductors, EV/HEV, LLC resonant converters, and wireless charging applications.

This article was posted on Jun 16, 2020

Digital attenuators operate from 200MHz to 8GHz

Vaunix, the portable and programmable RF/microwave test device specialist, has released the first two in a series of Lab Brick devices available with Ethernet control.

This article was posted on Jun 16, 2020

April IC sales up 6.2% y-o-y

April semiconductor sales were down 1.2% on March at $34.4 billion but 6.2% up on the $32.4 billion of April 2019, says the SIA.

This article was posted on Jun 16, 2020

Infineon adds 1,700V silicon carbide CoolSiC mosfets

Maximising the physical characteristics of SiC, this ensures that the 1700 V surface-mounted devices (SMD) offer superior reliability, as well as low switching and conduction losses.

This article was posted on Jun 15, 2020

Smiths in space

Smiths Interconnect has won a contract from Boeing to design, manufacture and supply bespoke connectors for use aboard NASA’s Orion spacecraft and Lunar Gateway.

This article was posted on Jun 15, 2020

Journos replaced by robots: Shock

Microsoft’s news site is to sack 50 journos and replace them with an AI programme, reports the Seattle Times.

This article was posted on Jun 15, 2020

US putting $37bn into semiconductors

The SIA has asked Washington for $37 billion for R&D, to build a fab and to provide funds for states wanting to give incentives to get semiconductor investment, according to the Wall Street Journal.

This article was posted on Jun 15, 2020

Wanted: Edge applications for 5G

SK Telecom has opened more TIP Ecosystem Acceleration Center (TEAC) programme applications to attract investors and startups to develop edge-based 5G services.

This article was posted on Jun 15, 2020

Crew Dragon successfully lifts off from US and docks with ISS

A SpaceX Crew Dragon spacecraft successfully launched from Florida at the weekend. It then successfully docked with the International Space Station within 24 hours.

This article was posted on Jun 15, 2020

Compact waterproof ac-dc PSUs put power conversion into the heart of industry

Puls Power has introduced a 500W industrial point-of-load ac-dc power supply that is environmentally protected in its own right, allowing installation without an additional cabinet.

This article was posted on Jun 15, 2020

Richardson signs AVX

Richardson RFPD, an Arrow Electronics company, has entered into a global franchise agreement with AVX.

This article was posted on Jun 15, 2020

Inertial sensor has six degrees of freedom

Murata has developed single package MEMs 6DoF (Six Degrees of Freedom) inertial sensor for safety-critical automotive applications.

This article was posted on Jun 15, 2020

Photonics set for double digit CAGR 2019-25

RF is the historical market driver for GaAs wafers. In 2019 it represented 33% of market volume and 37% of market value. RF represents 67% of the GaAs epiwafer open market, says Yole Developpement.

This article was posted on Jun 15, 2020

First auto-grade wafer-level camera claimed

OmniVision claims to have made announced the world’s first automotive-grade, wafer-level camera.

This article was posted on Jun 15, 2020

Reconfigurable architecture prepares for nascent space era

Travel to planets as well as working among the stars and lower orbits, are seeing renewed levels of interest and activity. Today, there are estimated to be 366bn commercial satellites and SpaceX, a private company is currently planning to launch the Falcon 9 rocket and NASA’s Crew Dragon spacecraft on 27 May.

This article was posted on Jun 12, 2020

Liquid crystal meta-surface steers automotive lidar

Liquid crystal meta-surfaces can steer lasers to create solid-state lidars for automotive and industrial applications, according to Lumotive of Seattle.

This article was posted on Jun 12, 2020

Linear LED driver for automotive lighting includes PWM

Rohm has introduced a linear LED driver for automotive use, following close on the heels of its LED driver for motorcycles.

This article was posted on Jun 12, 2020

Board for enhanced reliability applications

Sundance Multiprocessor has launched an Intel-based 3U OpenVPX single board computer (SBC) for enhanced reliability industrial control, automotive, mil/aero and UltraHD video and graphics processing applications.

This article was posted on Jun 12, 2020

20nm space-grade FPGA

The chip delivers 5.7 tera operations per second (TOPs) of peak INT8 performance optimized for deep learning, a nearly 25X increase compared to the prior generation.

This article was posted on Jun 12, 2020

Arrow, ST and Panasonic combine on IoT edge-intelligence module

Arrow, Panasonic, and ST have introduced a low-power wireless multi-sensor edge-intelligence module for smart factory, smart home, and smart life applications.

This article was posted on Jun 12, 2020

Sponsored Content: IoT-AdvantEdge™ Simplifies IoT Edge Product Design

The path to machine learning and personalization requires that some computing occur at the edge of the network. In fact, Gartner is forecasting that companies will generate up to 75 percent of their data outside a traditional data center within the next six years.1 Privacy is one big reason for the need for edge computing. As more devices become interconnected, it is much easier to protect data at the edge than when routed through a central server.

This article was posted on Jun 12, 2020