Arduino puts Wi-Fi and Bluetooth ESP32 processor into Nano
Arduino has introduced a Nano shaped board with a Wi-Fi and Bluetooth LE capable Espressif’s ESP32-S3 microcontroller, supporting it with the Arduino IDE and MicroPython.
This article was posted on Jul 27, 2023Dual 12V mosfet is drain-connected for battery packs
Toshiba is aiming at battery pack protection with a 12V 20A common-drain dual n-channel mosfet.
This article was posted on Jul 27, 2023Easby eyes a slice of the IoT market with Geniatech SBCs
Single board computers (SBCs) from Chinese industrial IoT and embedded board manufacturer, Geniatech, are now available from Easby Electronics.
This article was posted on Jul 27, 2023Hawkeye 360 raises $58m in Series D
HawkEye 360, the space-based RF data and analytics specialist has announced it has closed $58 million in new Series D-1 funding.
This article was posted on Jul 27, 2023PCB Market Falling But Auto PCB Market Rising
The PCB market will fall a further 5.2% this year to $79 billion, says TendForce.
This article was posted on Jul 27, 2023onsemi hooks up with BorgWarner on SiC
BorgWarner is to use onsemi power ICs in its traction inverters in a deal expected to be worth $1 billion over its lifetime.
This article was posted on Jul 27, 2023Stellantis contracts for auto ICs worth $11bn
Stellantis has signed contracts worth $11.2 billion to secure a supply of ICs for EVs for the next seven years.
This article was posted on Jul 27, 2023Sponsored Content: AC/DC Leakage Current Sensors and Real-Time Energy Sensors from Bituo Technik
Advancing electrical safety and energy efficiency with RCD and PMD technology integration.
This article was posted on Jul 27, 2023NSREC: GaN transistors in PSU design for space AI processor
Working with AMD, Renesas has created a power supply design, using radiation-tolerant ICs and GaN power devices, for an AMD space-grade ‘Versal adaptive SoC’ – the XQRVC1902, a processor with 400 AI inferencing tiles, dual Arm Cortex-A72 cores, dual Cortex-R5F cores, programmable logic and memory.
This article was posted on Jul 27, 2023Teledyne e2v Space Imaging launches recruitment drive
There’s room in space – Teledyne e2v Space Imaging, which is based in Chelmsford, is launching a recruitment drive, with interest in the UK commercial space sector continuing to grow.
This article was posted on Jul 26, 2023ST in volume production of e-mode PowerGaN HEMT devices
ST has begun volume production of e-mode PowerGaN HEMT devices that simplify the design of high-efficiency power-conversion systems.
This article was posted on Jul 26, 2023Co-Packaged Optics market to have 46% CAGR 2022-33
The Co-Packaged Optics (CPO) market is expected to reach $2.6 billion in 2033, following a 46% CAGR between 2022 and 2033, says Yole Developpement.
This article was posted on Jul 26, 2023British drone flies for months
A solar-powered drone built by BAE Warton, described as a High Altitude Pseudo Satellite (HAPS) Unmanned Aerial System (UAS) has reached 66,000 feet on its 24 hour maiden flight in New Mexico.
This article was posted on Jul 26, 2023IO-Link interface option for small compression and tension sensors
HBK has added an IO-Link interface option to its U9C (tension and compression, right) and C9C (compression only, below left) force sensors.
This article was posted on Jul 26, 2023“Widest axial mating tolerance” RF contacts
Component manufacturer and distributor Powell Electronics is claiming “the widest axial mating tolerance of blind-mate RF contacts currently available on the market” for coaxial connector parts from Phoenix Company of Chicago, which it is now stocking.
This article was posted on Jul 26, 2023Orbital wins $1.7m Space Force contract to manufacture antennas in space
Orbital Composites, an in-space robotic manufacturing specialist, has won a $1.7m U.S. Space Force contract, to further “the development of In-space Servicing, Assembly and Manufacturing (ISAM) of antennas”.
This article was posted on Jul 26, 2023Turmoil at SMIC
SMIC chairman Gao Yonggang has resigned in a long line of departures, to be replaced by a vice chairman Liu Xunfeng (pictured).
This article was posted on Jul 26, 2023167 300mm fabs operating this year; 180 next year
At the end of 2022, there were 167 semiconductor fabs processing 300mm wafers for the fabrication of ICs, including CMOS image sensors, and non-IC products such as power discretes.
This article was posted on Jul 26, 2023Hummingbird claims to be world’s first oNOC for AI workloads
The first public demonstration of Hummingbird, claimed to be the world’s first Optical Network-On-Chip for domain-specific AI workloads, will be at Hot Chips August 27-29 at Stanford University.
This article was posted on Jul 26, 2023Infra-red sensor shuns sunlight outdoors
Vishay has released an infra-red receiver designed to be used outdoors in light barriers and reflective presence detectors.
This article was posted on Jul 24, 2023Viewpoint: Ultra-early wildfire detection with IoT sensors using LoRaWAN
Why not use IoT-enabled sensors, using the LoRaWAN standard, for ‘ultra-early’ wildfire detection, asks Carsten Brinkschulte, co-founder and CEO of Dryad Networks?
This article was posted on Jul 24, 2023