NXP top-side-cooled RF amplifiers for smaller lighter 5G basestations
NXP has announced a family of top-side-cooled RF amplifiers, intended to shrink and lighten radios for 5G infrastructure – the company is claiming a reduction basestation thickness and weight of over 20% compared with those made with its bottom-side cooled amplifiers.
This article was posted on Jun 13, 202347.3% fall for Q1 SSD sales
Q1 SSD revenues fell 47.3% to $1.998 billion says TrendForce, despite production cut-backs.
This article was posted on Jun 13, 2023Rockley Photonics emerges from Chapter 11
Rockley Photonics has completed a comprehensive financial restructuring and emerged from Chapter 11 after filing for bankruptcy protection in Q1.
This article was posted on Jun 13, 2023Malaysian EMS provider Escatec builds fifth European site, in Bulgaria
To meet near-shoring requirements of European customers, Malaysian EMS (electronics manufacturing services) provider Escatec has established a production facility in Plovdiv Bulgaria.
This article was posted on Jun 13, 2023Multi-stage miniature thermoelectric coolers
Laird Thermal Systems has created a series of multi-stage thermo-electric coolers for miniature optical packages.
This article was posted on Jun 13, 2023Space Week launching in Cumbria, businesses invited on board
iSH, the Industrial Solutions Hub, is hosting a Space Week series of events across West Cumbria from 26-30 June.
This article was posted on Jun 13, 2023Avnet reports Q3 results
Avnet had Q3 sales of $6.5 billion for an operating income of $313 million which was up 4.9% q-o-q and 14.3% y-o-y.
This article was posted on Jun 13, 2023Backside Power Delivery by imec
Backside Power Delivery is seen as one of the most important technologies for future IC process improvements.
This article was posted on Jun 12, 2023Electron mobility faster in GeSn than in Si or Ge
Electrons and other charge carriers can move faster in germanium tin than in silicon or germanium, enabling lower operation voltages and smaller footprints in vertical than in planar devices, say CEA-Leti researchers.
This article was posted on Jun 12, 2023Agile Analog launches analogue IP subsystem
The initial subsystem includes all the analog IP required for a typical battery powered IoT system, including a power management unit (PMU), a sleep management unit (SMU), and data converters.
This article was posted on Jun 12, 2023Renesas and Nidec put inverter, on-board charger, and more, into vehicle motor-gearbox
Renesas Electronics has teamed up with electric motor maker Nidec to develop a 6-in-1 e-axle for electric vehicles.
This article was posted on Jun 12, 2023Can cartoon eyes help pedestrians trust autonomous cars?
Faced with an empty driving seat, pedestrians trust certain visual prompts when deciding whether to cross in front of an autonomous car, according to the University of Nottingham, which has studied such behaviour on its own campus.
This article was posted on Jun 12, 2023UL-certified recycled ABS polymer for electronics and vehicles
MBA Polymers UK has launched a recycled ABS (acrylonitrile butadiene styrene) feedstock for injection moulding in electronics, automotive and consumer industries.
This article was posted on Jun 12, 2023Backside power delivery to be a big deal for Intel
Backside power delivery, which Intel calls PowerVia, is going to be a big factor in the company’s 20A node due in 2024.
This article was posted on Jun 12, 2023GloFo and ST finalise fab agreement
GlobalFoundries and ST have completed the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.
This article was posted on Jun 12, 2023Satellite Vu raises further £12.7m in Series A-2 funding
Satellite Vu has raised a further £12.7m in Series A-2 funding, bringing its investment total to £30.5m.
This article was posted on Jun 12, 2023Satellite Vu raises further £12.7m in Series A-2 funding
Satellite Vu has raised a further £12.7m in Series A-2 funding, bringing its investment total to £30.5m.
This article was posted on Jun 12, 202354% Q1 fall for VR/AR headsets
Q1 shipments of AR and VR headsets fell 54.4% y-o-y with VR representing 96.2% of the VR/AR headsets shipped, according to (IDC) Worldwide Quarterly Augmented and Virtual Reality Headset Tracker.
This article was posted on Jun 12, 2023Iceye introduces Dwell capability for SAR satellite imagery
Iceye, the Finnish satellite imagery specialist, has introduced a new imaging mode, dubbed “Dwell”, for its synthetic-aperture radar (SAR) small satellites.
This article was posted on Jun 9, 2023Infineon and SPIL collaborate on verification workflow for fan-out packaging
Siemens Digital Industries Software and OSAT specialist Siliconware Precision Industries (SPIL) have implemented an IC package assembly planning and 3D layout vs. schematic (LVS) assembly verification workflow for SPIL’s fan-out family of advanced IC packaging technologies.
This article was posted on Jun 9, 2023Vitesco and onsemi hook up on SiC
Vitesco Technologies and onsemi have signed a long-term supply agreement for SiC products.
This article was posted on Jun 9, 2023