Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-0638306170 | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| Featured Product | Application Tooling | |
| Standard Package | 1 | |
| Category | Tools | |
| Family | Crimpers, Applicators, Presses - Accessories | |
| Series | * | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 0638306170 | |
| Related Links | 06383, 0638306170 Datasheet, Molex Connector Corporation Distributor | |
![]() | MCS04020C2200FE000 | RES SMD 220 OHM 1% 1/10W 0402 | datasheet.pdf | |
![]() | BUK9605-30A,118 | MOSFET N-CH 30V 75A D2PAK | datasheet.pdf | |
![]() | TAJC686K016H | CAP TANT 68UF 16V 10% 2312 | datasheet.pdf | |
![]() | 951438-8061506-AR | CONN HDR STR STACK 38POS 2MM T/H | datasheet.pdf | |
![]() | VI-BNM-CW-F4 | CONVERTER MOD DC/DC 10V 100W | datasheet.pdf | |
![]() | LMC6482IM | IC OPAMP GP 1.5MHZ RRO 8SOIC | datasheet.pdf | |
![]() | MSP-EXP430F5529LP | LAUNCH PAD DEV BOARD FOR 5529 | datasheet.pdf | |
![]() | BD90525EFJ-CE2 | IC REG BUCK 1.5V 2A SYNC 8HTSOP | datasheet.pdf | |
![]() | ATS-04B-127-C3-R0 | HEATSINK 54X54X20MM XCUT T412 | datasheet.pdf | |
![]() | BZX384C8V2-HE3-18 | DIODE ZENER 8.2V 200MW SOD323 | datasheet.pdf | |
![]() | P4SMA39A-M3/5A | TVS DIODE 33.3VWM 53.9VC DO-214A | datasheet.pdf | |
![]() | XQ4005E-4BG196N | QML High-Reliability FPGAs IC | datasheet.pdf |