Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-1.5MIC 3M661X DLF 3MIL 5 IN | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| MSDS Material Safety Datasheet | Diamond Lapping Film MSDS | |
| Featured Product | 3M™ Lapping and Polishing Films | |
| Standard Package | 25 | |
| Category | Tools | |
| Family | Fiber Optics and Accessories | |
| Series | 661X | |
| Type | Lapping Film | |
| Specifications | Diamond | |
| Size / Dimension | 5.00" Dia (127.0mm) | |
| For Use With/Related Products | Fiber Optics Connectors | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 1.5MIC 3M661X DLF 3MIL 5 IN | |
| Related Links | 1.5MIC 3M661X, 1.5MIC 3M661X DLF 3MIL 5 IN Datasheet, 3M Distributor | |
![]() | LT3500IMSE#PBF | IC REG DL BUCK/LINEAR 16-MSOP | datasheet.pdf | |
![]() | C0805C391J8RACTU | CAP CER 390PF 10V X7R 0805 | datasheet.pdf | |
![]() | QPO-2LZ-01 | 0.3-5.5V 20A OUT RIP ATTENUATOR | datasheet.pdf | |
![]() | RWR80S2501BSS73 | RES 2.5K OHM 2W 0.1% WW AXIAL | datasheet.pdf | |
![]() | E2SS-MT3 | TIE ROD BKT,80TO100MM DIA | datasheet.pdf | |
![]() | IELHK111-30299-271-V | CIRCUIT BREAKER MAG-HYDR LEVER | datasheet.pdf | |
![]() | XC7VX690T-3FFG1761E | IC FPGA 850 I/O 1761FCBGA | datasheet.pdf | |
![]() | 1226530000 | LXB 15.00/03/90 4.5SN BK BX | datasheet.pdf | |
![]() | 10127624-13610LF | CABLE ASSSY | datasheet.pdf | |
![]() | 162A11479X | CONN 15POS F R/A ASSY | datasheet.pdf | |
![]() | CXB1830-0000-000N0HU230H | LED COB CXB1830 3000K WHT SMD | datasheet.pdf | |
![]() | XCVU440-L1FLGB2377I | Field Programmable Gate Array, 2880 CLBs, PBGA2377 IC | datasheet.pdf |