Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
| Internal Part Number | EIS-10068597-11177LF | |
| Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Production Status (Lifecycle) | In Production | |
| Condition | New & Unused, Original Sealed | |
| PCN Packaging | Multiple Devices 24/Jul/2015 | |
| Standard Package | 48 | |
| Category | Connectors, Interconnects | |
| Family | Memory Connectors - Inline Module Sockets | |
| Series | 10068597 | |
| Packaging | Tray | |
| Connector Style | DIMM | |
| Number of Positions | 240 | |
| Memory Type | DDR 3 SDRAM | |
| Standards | MO-269 | |
| Mounting Type | Through Hole | |
| Features | Board Lock, Latches | |
| Mounting Feature | Normal, Standard - Top | |
| Contact Finish | Gold | |
| Contact Finish Thickness | 15µin (0.38µm) | |
| Weight | 0.001 KG | |
| Application | Email for details | |
| Alternative Part (Replacement) | 10068597-11177LF | |
| Related Links | 10068597, 10068597-11177LF Datasheet, FFF Distributor | |
| UHE2A681MHD | CAP ALUM 680UF 20% 100V RADIAL | datasheet.pdf | ||
![]() | 357-072-500-204 | CARDEDGE 72POS DL .156 BLK LOPRO | datasheet.pdf | |
![]() | RSC15DRAS | CONN EDGECARD 30POS R/A .100 SLD | datasheet.pdf | |
![]() | 170-025-172L010 | CONN DB25 CRIMP MALE TIN | datasheet.pdf | |
![]() | FKN50SFR-52-0R27 | RES 0.27 OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | D38999/24WC35SNSPL | CONN RCPT 22POS JAM NUT W/SCKT | datasheet.pdf | |
![]() | ERA-3APB623V | RES SMD 62K OHM 0.1% 1/10W 0603 | datasheet.pdf | |
![]() | RN65C4223FBSL | RES 422K OHM 1/2W 1% AXIAL | datasheet.pdf | |
![]() | CMF55210R00BEEB | RES 210 OHM 1/2W 0.1% AXIAL | datasheet.pdf | |
![]() | ECC10DPNS | CONN EDGECARD 20POS .100" | datasheet.pdf | |
![]() | R463R410000M1K | CAP FILM 1UF 10% 630VDC RADIAL | datasheet.pdf | |
![]() | XC2C250-5FG456C | XILINX IC XC2C250-5FG456C Available | datasheet.pdf |