Ship from: HONGKONG
Date Code: Newest Date Code
Manufacturer lead time 6 weeks
Internal Part Number | EIS-15-42-6032 | |
Lead Free Status / RoHS Status | Lead free / RoHS Compliant | |
Moisture Sensitivity Level (MSL) | ||
Production Status (Lifecycle) | Obsolete / Discontinued | |
Condition | New & Unused, Original Sealed | |
Video File | Molex - Product of the Quarter - Mini-Fit® | |
PCN Obsolescence/ EOL | 8723 Series 11/Sept/2007 | |
Standard Package | 1 | |
Category | Connectors, Interconnects | |
Family | Rectangular Connectors - Headers, Male Pins | |
Series | C-Grid® 8723 | |
Packaging | Tube | |
Contact Type | Male Pin | |
Connector Type | Header, Shrouded | |
Number of Positions | 32 | |
Number of Positions Loaded | All | |
Pitch | 0.100" (2.54mm) | |
Number of Rows | 2 | |
Row Spacing | 0.100" (2.54mm) | |
Contact Mating Length | 0.315" (8.00mm) | |
Mounting Type | Through Hole | |
Termination | Solder | |
Fastening Type | - | |
Features | - | |
Contact Finish | Tin | |
Contact Finish Thickness | 150µin (3.81µm) | |
Color | Black | |
Weight | 0.001 KG | |
Application | Email for details | |
Alternative Part (Replacement) | 15-42-6032 | |
Related Links | 15-42, 15-42-6032 Datasheet, Molex Connector Corporation Distributor |
![]() | TPA2001D1EVM | EVAL MOD FOR TPA2001D1 | datasheet.pdf | |
![]() | 5745051-1 | D-Sub Connector Plug, Male Pins 9 Position Through Hole Solder | datasheet.pdf | |
![]() | SMAJ28-E3/5A | TVS DIODE 28VWM 50VC SMA | datasheet.pdf | |
![]() | SG-210SDD 62.5000ML3 | OSC XO 62.50MHZ CMOS SMD | datasheet.pdf | |
![]() | RLR07C3572FRRSL | RES 35.7K OHM 1% 1/4W AXIAL | datasheet.pdf | |
![]() | 82344788 | 115/60 CW 6RPM 79200 | datasheet.pdf | |
![]() | 502DCF-ACAF | OSC PROG 1.3NS 20PPM 2.5X3.2MM | datasheet.pdf | |
![]() | 1458240 | CABLE | datasheet.pdf | |
![]() | ECC31DTAN-S189 | CONN EDGECARD 62POS .100" | datasheet.pdf | |
![]() | GTS06CF-20-19S | CONN PLUG 3POS INLINE SKT | datasheet.pdf | |
![]() | 300X11249X | 25POS DIE CAST SHORT SCR | datasheet.pdf | |
![]() | LDB311G8020C-300 | Chip Multilayer Hybrid Baluns | datasheet.pdf |